Issued Patents All Time
Showing 1–25 of 86 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12419124 | Method for forming light pipe structure with high quantum efficiency | Tsun-Kai Tsao, Shih Pei Chou, Tzu-Ming Wang | 2025-09-16 |
| 12349476 | Recessed blocking structure for BLC pixels | Chun-Tsung Kuo | 2025-07-01 |
| 12341115 | Bond pad structure with reduced step height and increased electrical isolation | Shih Pei Chou | 2025-06-24 |
| 12317613 | Self aligned grids in BSI image sensor | Tsun-Kai Tsao, Shih Pei Chou, Wei Chuang Wu | 2025-05-27 |
| 12176266 | Through-substrate via formation to enlarge electrochemical plating window | Hung-Ling Shih, Ming Chyi Liu | 2024-12-24 |
| 12165911 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Kuan-Liang Liu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2024-12-10 |
| 12132075 | Method (and related apparatus) for forming a resistor over a semiconductor substrate | Hung-Wen Hsu, Li-Weng Chang | 2024-10-29 |
| 12015049 | Ring structure for film resistor | Chun-Tsung Kuo | 2024-06-18 |
| 12002828 | Absorption enhancement structure to increase quantum efficiency of image sensor | Tsun-Kai Tsao, Cheng-Hsien Chou | 2024-06-04 |
| 11948962 | Charge release layer to remove charge carriers from dielectric grid structures in image sensors | Ching-Chung Su | 2024-04-02 |
| 11923394 | Concave reflector for complementary metal oxide semiconductor image sensor (CIS) | Po-Han Huang, Yu-Chun Chen | 2024-03-05 |
| 11916091 | BSI image sensor and method of forming same | Hung-Wen Hsu, Yeur-Luen Tu, U-Ting Chen, Shu-Ting Tsai, Hsiu-Yu Cheng | 2024-02-27 |
| 11869761 | Back-side deep trench isolation structure for image sensor | Yu-Hung Cheng, Chun-Tsung Kuo, Min-Ying Tsai, Chiao-Chun Hsu, Ching-I Li | 2024-01-09 |
| 11855159 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Cheng-Ta Wu, Chia-Shiung Tsai, Kuo-Hwa Tzeng, Shih Pei Chou, Yu-Hung Cheng +1 more | 2023-12-26 |
| 11830764 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Kuan-Liang Liu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2023-11-28 |
| 11776985 | Method of forming self aligned grids in BSI image sensor | Tsun-Kai Tsao, Shih Pei Chou, Wei Chuang Wu | 2023-10-03 |
| 11769778 | Method for forming light pipe structure with high quantum efficiency | Tsun-Kai Tsao, Shih Pei Chou, Tzu-Ming Wang | 2023-09-26 |
| 11756970 | Metal grid structure to improve image sensor performance | Ming Chyi Liu | 2023-09-12 |
| 11710783 | Bipolar junction transistor (BJT) comprising a multilayer base dielectric film | Chun-Tsung Kuo | 2023-07-25 |
| 11652025 | Through-substrate via formation to enlarge electrochemical plating window | Hung-Ling Shih, Ming Chyi Liu | 2023-05-16 |
| 11600647 | Absorption enhancement structure to increase quantum efficiency of image sensor | Tsun-Kai Tsao, Cheng-Hsien Chou | 2023-03-07 |
| 11522004 | Absorption enhancement structure for image sensor | Ching-Chung Su, Hung-Wen Hsu, Shih Pei Chou | 2022-12-06 |
| 11495489 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Kuan-Liang Liu, Shih Pei Chou, Yu-Hung Cheng +1 more | 2022-11-08 |
| 11450700 | Semiconductor image sensor pixel isolation structure for reducing crosstalk | Tsun-Kai Tsao | 2022-09-20 |
| 11380728 | Charge release layer to remove charge carriers from dielectric grid structures in image sensors | Ching-Chung Su | 2022-07-05 |