Issued Patents All Time
Showing 1–25 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381195 | Semiconductor devices and methods of manufacture thereof | Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, U-Ting Chen | 2025-08-05 |
| 11916091 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, U-Ting Chen, Hsiu-Yu Cheng | 2024-02-27 |
| 11915977 | Interconnect structure for stacked device | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang +3 more | 2024-02-27 |
| 11798916 | 3DIC interconnect apparatus and method | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Chia-Chieh Lin, U-Ting Chen | 2023-10-24 |
| 11769781 | Backside illuminated global shutter image sensor | Jeng-Shyan Lin, Tzu-Hsuan Hsu | 2023-09-26 |
| 11596800 | Interconnect structure and method of forming same | Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2023-03-07 |
| 11315972 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, U-Ting Chen, Hsiu-Yu Cheng | 2022-04-26 |
| 11018177 | Backside illuminated global shutter image sensor | Jeng-Shyan Lin, Tzu-Hsuan Hsu | 2021-05-25 |
| 11011567 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2021-05-18 |
| 10978345 | Interconnect structure for stacked device | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang +3 more | 2021-04-13 |
| 10861899 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu +1 more | 2020-12-08 |
| 10847560 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, U-Ting Chen, Hsiu-Yu Cheng | 2020-11-24 |
| 10840287 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin +4 more | 2020-11-17 |
| 10818720 | Stacked image sensor having a barrier layer | U-Ting Chen, Cheng-Ying Ho, Tzu-Hsuan Hsu, Shih Pei Chou | 2020-10-27 |
| 10763292 | Interconnect apparatus and method for a stacked semiconductor device | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shih Pei Chou +2 more | 2020-09-01 |
| 10682523 | Interconnect structure and method of forming same | Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2020-06-16 |
| 10535706 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu +1 more | 2020-01-14 |
| 10535697 | Structure and method for 3D Image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2020-01-14 |
| 10510729 | 3DIC interconnect apparatus and method | Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen, Shih Pei Chou | 2019-12-17 |
| 10361234 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin +4 more | 2019-07-23 |
| 10304818 | Method of manufacturing semiconductor devices having conductive plugs with varying widths | Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, U-Ting Chen | 2019-05-28 |
| 10283547 | Stacked image sensor having a barrier layer | U-Ting Chen, Cheng-Ying Ho, Tzu-Hsuan Hsu, Shih Pei Chou | 2019-05-07 |
| 10269843 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, U-Ting Chen, Hsiu-Yu Cheng | 2019-04-23 |
| 10163956 | Interconnect apparatus and method | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shih Pei Chou +2 more | 2018-12-25 |
| 10157959 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu +1 more | 2018-12-18 |