Issued Patents All Time
Showing 1–25 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424577 | Isolation structure for bond pad structure | Sin-Yao Huang, Shih Pei Chou, Tzu-Hsuan Hsu | 2025-09-23 |
| 12400984 | Isolation structure for bond pad structure | Sin-Yao Huang, Shih Pei Chou, Tzu-Hsuan Hsu | 2025-08-26 |
| 12382744 | Stacked substrate structure with inter-tier interconnection | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Wei-Chih Weng, Yu-Yang Shen | 2025-08-05 |
| 11996433 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Ching-Chun Wang, Dun-Nian Yaung, Shyh-Fann Ting | 2024-05-28 |
| 11973101 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2024-04-30 |
| 11923338 | Stacked integrated circuits with redistribution lines | Cheng-Ying Ho, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai | 2024-03-05 |
| 11915977 | Interconnect structure for stacked device | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang +3 more | 2024-02-27 |
| 11817470 | Stacked substrate structure with inter-tier interconnection | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Wei-Chih Weng, Yu-Yang Shen | 2023-11-14 |
| 11769781 | Backside illuminated global shutter image sensor | Shu-Ting Tsai, Tzu-Hsuan Hsu | 2023-09-26 |
| 11694979 | Isolation structure for bond pad structure | Sin-Yao Huang, Shih Pei Chou, Tzu-Hsuan Hsu | 2023-07-04 |
| 11596800 | Interconnect structure and method of forming same | Shu-Ting Tsai, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2023-03-07 |
| 11342374 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2022-05-24 |
| 11322540 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Ching-Chun Wang, Dun-Nian Yaung, Shyh-Fann Ting | 2022-05-03 |
| 11244925 | Semiconductor device structure with back-side layer to reduce leakage | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang | 2022-02-08 |
| 11222915 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Ching-Chun Wang, Dun-Nian Yaung, Shyh-Fann Ting | 2022-01-11 |
| 11152414 | Image sensor including dual isolation and method of making the same | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Volume Chien | 2021-10-19 |
| 11043522 | Stacked substrate structure with inter-tier interconnection | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Wei-Chih Weng, Yu-Yang Shen | 2021-06-22 |
| 11018177 | Backside illuminated global shutter image sensor | Shu-Ting Tsai, Tzu-Hsuan Hsu | 2021-05-25 |
| 11011567 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2021-05-18 |
| 10991667 | Isolation structure for bond pad structure | Sin-Yao Huang, Shih Pei Chou, Tzu-Hsuan Hsu | 2021-04-27 |
| 10991752 | Vertically integrated image sensor chips and methods for forming the same | Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, Wen-De Wang +1 more | 2021-04-27 |
| 10978345 | Interconnect structure for stacked device | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang +3 more | 2021-04-13 |
| 10879297 | Image sensor device and method of forming same | Wen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang | 2020-12-29 |
| 10833119 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Ching-Chun Wang, Dun-Nian Yaung, Shyh-Fann Ting | 2020-11-10 |
| 10790265 | Semiconductor device structure with back-side layer to reduce leakage | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang | 2020-09-29 |