Issued Patents All Time
Showing 26–50 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763292 | Interconnect apparatus and method for a stacked semiconductor device | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shih Pei Chou +2 more | 2020-09-01 |
| 10682523 | Interconnect structure and method of forming same | Shu-Ting Tsai, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2020-06-16 |
| 10672819 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2020-06-02 |
| 10629568 | Stacked integrated circuits with redistribution lines | Cheng-Ying Ho, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai | 2020-04-21 |
| 10535696 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2020-01-14 |
| 10490580 | Image sensor pickup region layout | Dun-Nian Yaung, Ching-Chun Wang, Feng-Chi Hung, Yan-Chih Lu | 2019-11-26 |
| 10290671 | Image sensor device and method of forming same | Wen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang | 2019-05-14 |
| 10269768 | Stacked integrated circuits with redistribution lines | Cheng-Ying Ho, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai | 2019-04-23 |
| 10192918 | Image sensor including dual isolation and method of making the same | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Volume Chien | 2019-01-29 |
| 10163973 | Method for forming the front-side illuminated image sensor device structure with light pipe | Feng-Kuei Chang, Keng-Yu Chou, Jen-Cheng Liu | 2018-12-25 |
| 10163956 | Interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shih Pei Chou +2 more | 2018-12-25 |
| 10157958 | Vertically integrated image sensor chips and methods for forming the same | Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, Wen-De Wang +1 more | 2018-12-18 |
| 10153316 | Mechanisms for forming image sensor device with deep-trench isolation structure | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2018-12-11 |
| 10121812 | Stacked substrate structure with inter-tier interconnection | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Wei-Chih Weng, Yu-Yang Shen | 2018-11-06 |
| 10096515 | Interconnect structure for stacked device | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang +3 more | 2018-10-09 |
| 10092768 | Interconnect structure and method of forming same | Shu-Ting Tsai, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2018-10-09 |
| 10062728 | Image sensor device and method | Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Shuang-Ji Tsai | 2018-08-28 |
| 9941249 | Multi-wafer stacking by Ox-Ox bonding | Shu-Ting Tsai, Szu-Ying Chen, Tzu-Hsuan Hsu, Feng-Chi Hung, Dun-Nian Yaung | 2018-04-10 |
| 9875989 | Semiconductor device structure | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang | 2018-01-23 |
| 9865630 | Image sensor pickup region layout | Dun-Nian Yaung, Ching-Chun Wang, Feng-Chi Hung, Yan-Chih Lu | 2018-01-09 |
| 9847368 | Vertically integrated image sensor chips and methods for forming the same | Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, Wen-De Wang +1 more | 2017-12-19 |
| 9812487 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2017-11-07 |
| 9812409 | Seal ring structure with a metal pad | Dun-Nian Yaung, Jen-Cheng Liu, Hsin-Hui Lee, Wen-De Wang, Shu-Ting Tsai | 2017-11-07 |
| 9812482 | Frontside illuminated (FSI) image sensor with a reflector | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang, Tzu-Hsuan Hsu | 2017-11-07 |
| 9786592 | Integrated circuit structure and method of forming the same | Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao, Hsun-Ying Huang | 2017-10-10 |