Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396283 | 3DIC seal ring structure and methods of forming same | Pao-Tung Chen, Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2025-08-19 |
| 11923338 | Stacked integrated circuits with redistribution lines | Jeng-Shyan Lin, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai | 2024-03-05 |
| 11837595 | Semiconductor device structure and method for manufacturing the same | Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2023-12-05 |
| 11532661 | 3DIC seal ring structure and methods of forming same | Pao-Tung Chen, Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2022-12-20 |
| 11088192 | Metal block and bond pad structure | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Yan-Chih Lu | 2021-08-10 |
| 10818720 | Stacked image sensor having a barrier layer | U-Ting Chen, Shu-Ting Tsai, Tzu-Hsuan Hsu, Shih Pei Chou | 2020-10-27 |
| 10629568 | Stacked integrated circuits with redistribution lines | Jeng-Shyan Lin, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai | 2020-04-21 |
| 10522525 | Semiconductor device structure | Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2019-12-31 |
| 10510792 | 3DIC seal ring structure and methods of forming same | Pao-Tung Chen, Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2019-12-17 |
| 10297631 | Metal block and bond pad structure | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Yan-Chih Lu | 2019-05-21 |
| 10283547 | Stacked image sensor having a barrier layer | U-Ting Chen, Shu-Ting Tsai, Tzu-Hsuan Hsu, Shih Pei Chou | 2019-05-07 |
| 10269768 | Stacked integrated circuits with redistribution lines | Jeng-Shyan Lin, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai | 2019-04-23 |
| 9887182 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou, Hui-Wen Shen +4 more | 2018-02-06 |
| 9818735 | Method of manufacturing a semiconductor device | Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2017-11-14 |
| 9806119 | 3DIC seal ring structure and methods of forming same | Pao-Tung Chen, Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2017-10-31 |
| 9666566 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou, Hui-Wen Shen +4 more | 2017-05-30 |
| 9536920 | Stacked image sensor having a barrier layer | U-Ting Chen, Shu-Ting Tsai, Tzu-Hsuan Hsu, Shih Pei Chou | 2017-01-03 |
| 9449914 | Stacked integrated circuits with redistribution lines | Jeng-Shyan Lin, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai | 2016-09-20 |
| 9437578 | Stacked IC control through the use of homogenous region | Wen-I Hsu, Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung | 2016-09-06 |
| 9142690 | Semiconductor device having a bonding pad and shield structure and method of manufacturing the same | Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Jeng-Shyan Lin | 2015-09-22 |
| 9117879 | Semiconductor device and manufacturing method thereof | Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2015-08-25 |
| 8710612 | Semiconductor device having a bonding pad and shield structure of different thickness | Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Jeng-Shyan Lin | 2014-04-29 |
| 8502389 | CMOS image sensor and method for forming the same | Dun-Nian Yaung, Jen-Cheng Liu, Jeng-Shyan Lin, Wen-De Wang, Shih Pei Chou | 2013-08-06 |