Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335716 | Photosensing pixel, image sensor and method of fabricating the same | Sin-Yao Huang, Feng-Chi Hung, Chen-Hsien Lin, Tzu-Hsuan Hsu | 2022-05-17 |
| 11088192 | Metal block and bond pad structure | Cheng-Ying Ho, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2021-08-10 |
| 10490580 | Image sensor pickup region layout | Dun-Nian Yaung, Ching-Chun Wang, Feng-Chi Hung, Jeng-Shyan Lin | 2019-11-26 |
| 10297631 | Metal block and bond pad structure | Cheng-Ying Ho, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2019-05-21 |
| 9865630 | Image sensor pickup region layout | Dun-Nian Yaung, Ching-Chun Wang, Feng-Chi Hung, Jeng-Shyan Lin | 2018-01-09 |
| 9728521 | Hybrid bond using a copper alloy for yield improvement | Yu-Cheng Tsai, Chun-Chieh Chuang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung +2 more | 2017-08-08 |
| 9391101 | Image sensor pickup region layout | Dun-Nian Yaung, Ching-Chun Wang, Feng-Chi Hung, Jeng-Shyan Lin | 2016-07-12 |
| 9331032 | Hybrid bonding and apparatus for performing the same | Ping-Yin Liu, Xin-Hua Huang, Chih-Hui Huang, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2016-05-03 |