Issued Patents All Time
Showing 1–25 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300670 | Hybrid bond pad structure | Sin-Yao Huang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2025-05-13 |
| 11804473 | Hybrid bond pad structure | Sin-Yao Huang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2023-10-31 |
| 11798916 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Chia-Chieh Lin, U-Ting Chen | 2023-10-24 |
| 11596800 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2023-03-07 |
| 11152414 | Image sensor including dual isolation and method of making the same | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Volume Chien | 2021-10-19 |
| 11024602 | Hybrid bond pad structure | Sin-Yao Huang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2021-06-01 |
| 11011567 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2021-05-18 |
| 10886320 | Mechanisms for forming image-sensor device with epitaxial isolation feature | Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu | 2021-01-05 |
| 10879297 | Image sensor device and method of forming same | Wen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Jeng-Shyan Lin | 2020-12-29 |
| 10861899 | Interconnect structure for stacked device and method | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2020-12-08 |
| 10682523 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2020-06-16 |
| 10535697 | Structure and method for 3D Image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2020-01-14 |
| 10535706 | Interconnect structure for stacked device and method | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2020-01-14 |
| 10515994 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung, Min-Feng Kao | 2019-12-24 |
| 10290671 | Image sensor device and method of forming same | Wen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Jeng-Shyan Lin | 2019-05-14 |
| 10276622 | Mechanisms for forming image-sensor device with expitaxial isolation feature | Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu | 2019-04-30 |
| 10269770 | Hybrid bond pad structure | Sin-Yao Huang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2019-04-23 |
| 10192918 | Image sensor including dual isolation and method of making the same | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Volume Chien | 2019-01-29 |
| 10157959 | Interconnect structure for stacked device and method | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2018-12-18 |
| 10092768 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2018-10-09 |
| 10090353 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung, Min-Feng Kao | 2018-10-02 |
| 10056353 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Chia-Chieh Lin, U-Ting Chen | 2018-08-21 |
| 9887182 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Cheng-Ying Ho, Sheng-Chau Chen, Shih Pei Chou, Hui-Wen Shen +4 more | 2018-02-06 |
| 9865645 | Interconnect structure for stacked device and method | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2018-01-09 |
| 9837464 | Backside structure and methods for BSI image sensors | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2017-12-05 |