Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9887182 | 3DIC structure and method for hybrid bonding semiconductor wafers | Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou, Hui-Wen Shen +4 more | 2018-02-06 |
| 9728521 | Hybrid bond using a copper alloy for yield improvement | Yu-Cheng Tsai, Chun-Chieh Chuang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung +2 more | 2017-08-08 |
| 9666566 | 3DIC structure and method for hybrid bonding semiconductor wafers | Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou, Hui-Wen Shen +4 more | 2017-05-30 |