Issued Patents All Time
Showing 1–25 of 133 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315843 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2025-05-27 |
| 12300670 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2025-05-13 |
| 12261196 | Metal-insulator-metal device capacitance enhancement | Lu-Sheng Chou, Hsuan-Han Tseng, Chun-Yuan Chen, Hsiao-Hui Tseng | 2025-03-25 |
| 12243907 | Multi-layer trench capacitor structure | Hsuan-Han Tseng, Chun-Yuan Chen, Lu-Sheng Chou, Hsiao-Hui Tseng | 2025-03-04 |
| 12211876 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2025-01-28 |
| 11996433 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Dun-Nian Yaung, Jeng-Shyan Lin, Shyh-Fann Ting | 2024-05-28 |
| 11984465 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2024-05-14 |
| 11948949 | Vertical gate field effect transistor | Chun-Yuan Chen, Hsiao-Hui Tseng, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2024-04-02 |
| 11916100 | Multi-layer trench capacitor structure | Hsuan-Han Tseng, Chun-Yuan Chen, Lu-Sheng Chou, Hsiao-Hui Tseng | 2024-02-27 |
| 11894410 | Bond pad structure for bonding improvement | Sin-Yao Huang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2024-02-06 |
| 11804473 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2023-10-31 |
| 11756972 | Apparatus for reducing optical cross-talk in image sensors | Chin-Min Lin, Dun-Nian Yaung, Chun-Ming Su, Tzu-Hsuan Hsu | 2023-09-12 |
| 11728366 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2023-08-15 |
| 11705474 | Metal reflector grounding for noise reduction in light detector | Yen-Ting Chiang, Dun-Nian Yaung, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting +1 more | 2023-07-18 |
| 11495630 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2022-11-08 |
| 11424228 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin | 2022-08-23 |
| 11410972 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2022-08-09 |
| 11404460 | Vertical gate field effect transistor | Chun-Yuan Chen, Hsiao-Hui Tseng, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2022-08-02 |
| 11387167 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Kuan-Chieh Huang, Hsing-Chih Lin +1 more | 2022-07-12 |
| 11342373 | Manufacturing method of image sensing device | Wei Chuang Wu, Ming-Tsong Wang, Feng-Chi Hung, Jen-Cheng Liu, Dun-Nian Yaung | 2022-05-24 |
| 11322540 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Dun-Nian Yaung, Jeng-Shyan Lin, Shyh-Fann Ting | 2022-05-03 |
| 11322481 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2022-05-03 |
| 11282802 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Dun-Nian Yaung, Feng-Chi Hung, Sin-Yao Huang | 2022-03-22 |
| 11244981 | Bond pad structure for bonding improvement | Sin-Yao Huang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2022-02-08 |
| 11227889 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2022-01-18 |