Issued Patents All Time
Showing 1–25 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396272 | Stilted pad structure | Sin-Yao Huang, Hung-Ling Shih, Hung-Wen Hsu | 2025-08-19 |
| 12363941 | GAA LDMOS structure for HV operation | Hong-Shyang Wu | 2025-07-15 |
| 12328931 | Hybrid integrated circuit dies and methods of forming the same | Hong-Shyang Wu | 2025-06-10 |
| 12315843 | Hybrid bonding technology for stacking integrated circuits | Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2025-05-27 |
| 12317722 | Color display with color filter layer comprising two-dimensional photonic crystals formed in a dielectric layer | Hong-Shyang Wu | 2025-05-27 |
| 12293946 | Techniques for wafer stack processing | Yung-Lung Lin, Cheng-Hsien Chou, Cheng-Yuan Tsai, Hau-Yi Hsiao | 2025-05-06 |
| 12289905 | Semiconductor structure and associated fabricating method | Jia-Rui Lee, Yi-Chun Lin | 2025-04-29 |
| 12278151 | Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrate | Ming-Che Lee, Sheng-Chau Chen, Hau-Yi Hsiao, Guanyu Luo, Ping-Tzu Chen +1 more | 2025-04-15 |
| 12211741 | Multi-wafer capping layer for metal arcing protection | Chih-Hui Huang, Cheng-Hsien Chou, Cheng-Yuan Tsai, Sheng-Chan Li | 2025-01-28 |
| 12205855 | Process tool for analyzing bonded workpiece interface | Hau-Yi Hsiao, Chun-Liang Chen, Sheng-Chau Chen | 2025-01-21 |
| 12125763 | Trim wall protection method for multi-wafer stacking | Sheng-Chan Li, Cheng-Hsien Chou, Sheng-Chau Chen, Cheng-Yuan Tsai | 2024-10-22 |
| 12087756 | Protective wafer grooving structure for wafer thinning and methods of using the same | Ming-Che Lee, Hau-Yi Hsiao, Cheng-Hsien Chou, Sheng-Chau Chen, Cheng-Yuan Tsai | 2024-09-10 |
| 12062687 | Semiconductor device including a capacitor | Hong-Yang CHEN, Tian Sheng Lin, Yi-Cheng Chiu, Hung-Chou Lin, Yi-Min Chen +1 more | 2024-08-13 |
| 11984431 | 3DIC structure and methods of forming | Yung-Lung Lin, Zhi-Yang Wang, Sheng-Chau Chen, Cheng-Hsien Chou | 2024-05-14 |
| 11951569 | Damage prevention during wafer edge trimming | Yung-Lung Lin, Hau-Yi Hsiao, Sheng-Chau Chen, Cheng-Yuan Tsai | 2024-04-09 |
| 11942543 | Semiconductor device structure with high voltage device | Hung-Chou Lin, Yi-Cheng Chiu, Karthick Murukesan, Yi-Min Chen, Shiuan-Jeng Lin +4 more | 2024-03-26 |
| 11942541 | Semiconductor device and method for forming the same | Hong-Shyang Wu | 2024-03-26 |
| 11935950 | High voltage transistor structure | Po-Yu Chen, Wan-Hua Huang, Jing Chen | 2024-03-19 |
| 11862675 | High voltage metal-oxide-semiconductor (HVMOS) device integrated with a high voltage junction termination (HVJT) device | Karthick Murukesan, Wen-Chih Chiang, Chun Lin Tsai, Ker Hsiao Huo, Po-Chih Chen +5 more | 2024-01-02 |
| 11862515 | Multi-wafer capping layer for metal arcing protection | Chih-Hui Huang, Cheng-Hsien Chou, Cheng-Yuan Tsai, Sheng-Chan Li | 2024-01-02 |
| 11855158 | Semiconductor device structure having a gate structure and overlying dielectric layer | Hong-Shyang Wu | 2023-12-26 |
| 11848321 | Semiconductor device for providing spike voltage protection and manufacturing method thereof | Hong-Shyang Wu | 2023-12-19 |
| 11842992 | Seal ring structures and methods of forming same | Kuan-Liang Liu, Wen-De Wang, Yung-Lung Lin | 2023-12-12 |
| 11832496 | Color display with color filter layer comprising two-dimensional photonic crystals formed in a dielectric layer | Hong-Shyang Wu | 2023-11-28 |
| 11728374 | Semiconductor device including a capacitor | Hong-Yang CHEN, Tian Sheng Lin, Yi-Cheng Chiu, Hung-Chou Lin, Yi-Min Chen +1 more | 2023-08-15 |