Issued Patents All Time
Showing 1–25 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396283 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Pao-Tung Chen, Jen-Cheng Liu, Dun-Nian Yaung | 2025-08-19 |
| 12154939 | High capacitance MIM device with self aligned spacer | Ching-Sheng Chu, Dun-Nian Yaung, Yu-Cheng Tsai, Meng-Hsien Lin, Ching-Chung Su +2 more | 2024-11-26 |
| 11901396 | Back side illuminated image sensor with reduced sidewall-induced leakage | Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Hsiao-Hui Tseng | 2024-02-13 |
| 11842992 | Seal ring structures and methods of forming same | Kuo-Ming Wu, Kuan-Liang Liu, Yung-Lung Lin | 2023-12-12 |
| 11837595 | Semiconductor device structure and method for manufacturing the same | Cheng-Ying Ho, Jen-Cheng Liu, Dun-Nian Yaung | 2023-12-05 |
| 11769791 | High capacitance MIM device with self aligned spacer | Ching-Sheng Chu, Dun-Nian Yaung, Yu-Cheng Tsai, Meng-Hsien Lin, Ching-Chung Su +2 more | 2023-09-26 |
| 11532661 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Pao-Tung Chen, Jen-Cheng Liu, Dun-Nian Yaung | 2022-12-20 |
| 11476295 | Back side illuminated image sensor with reduced sidewall-induced leakage | Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Hsiao-Hui Tseng | 2022-10-18 |
| 11342322 | Seal ring structures and methods of forming same | Kuo-Ming Wu, Kuan-Liang Liu, Yung-Lung Lin | 2022-05-24 |
| 11114486 | Implant isolated devices and method for forming the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wen-I Hsu | 2021-09-07 |
| 10991752 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen +1 more | 2021-04-27 |
| 10879297 | Image sensor device and method of forming same | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin | 2020-12-29 |
| 10727218 | Seal ring structures and methods of forming same | Kuo-Ming Wu, Kuan-Liang Liu, Yung-Lung Lin | 2020-07-28 |
| 10566378 | Back side illuminated image sensor with reduced sidewall-induced leakage | Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Hsiao-Hui Tseng | 2020-02-18 |
| 10535696 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Shuang-Ji Tsai, Yueh-Chiou Lin | 2020-01-14 |
| 10522525 | Semiconductor device structure | Cheng-Ying Ho, Jen-Cheng Liu, Dun-Nian Yaung | 2019-12-31 |
| 10510792 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Pao-Tung Chen, Jen-Cheng Liu, Dun-Nian Yaung | 2019-12-17 |
| 10453832 | Seal ring structures and methods of forming same | Kuo-Ming Wu, Kuan-Liang Liu, Yung-Lung Lin | 2019-10-22 |
| 10290671 | Image sensor device and method of forming same | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin | 2019-05-14 |
| 10157958 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen +1 more | 2018-12-18 |
| 10128304 | Isolation for semiconductor devices | Wen-I Hsu, Min-Feng Kao, Jen-Cheng Liu, Dun-Nian Yaung, Tzu-Hsuan Hsu | 2018-11-13 |
| 10008532 | Implant isolated devices and method for forming the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wen-I Hsu | 2018-06-26 |
| 9935147 | Deep trench isolation structure in image sensor device | Hsin-Hung Chen, Dun-Nian Yaung, Jen-Cheng Liu, Alexander Kalnitsky | 2018-04-03 |
| 9847368 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen +1 more | 2017-12-19 |
| 9837464 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2017-12-05 |