WW

Wen-De Wang

TSMC: 83 patents #352 of 12,232Top 3%
📍 Zhumaoya, TW: #3 of 25 inventorsTop 15%
Overall (All Time): #21,028 of 4,157,543Top 1%
83
Patents All Time

Issued Patents All Time

Showing 26–50 of 83 patents

Patent #TitleCo-InventorsDate
9818735 Method of manufacturing a semiconductor device Cheng-Ying Ho, Jen-Cheng Liu, Dun-Nian Yaung 2017-11-14
9812409 Seal ring structure with a metal pad Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Hsin-Hui Lee, Shu-Ting Tsai 2017-11-07
9806119 3DIC seal ring structure and methods of forming same Cheng-Ying Ho, Pao-Tung Chen, Jen-Cheng Liu, Dun-Nian Yaung 2017-10-31
9773828 Image sensor device and method of forming same Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin 2017-09-26
9673246 Dual metal for a backside package of backside illuminated image sensor Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Jhy-Ming Hung, Pao-Tung Chen 2017-06-06
9673245 Implant isolated devices and method for forming the same Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wen-I Hsu 2017-06-06
9653508 Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Shuang-Ji Tsai, Yueh-Chiou Lin 2017-05-16
9613996 Backside structure and methods for BSI image sensors Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Keng-Yu Chou, Shuang-Ji Tsai +1 more 2017-04-04
9576999 Backside structure and methods for BSI image sensors Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Keng-Yu Chou, Shuang-Ji Tsai +1 more 2017-02-21
9570497 Back side illuminated image sensor having isolated bonding pads Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Hsiao-Hui Tseng 2017-02-14
9570503 Ridge structure for back side illuminated image sensor Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Keng-Yu Chou, Pao-Tung Chen 2017-02-14
9520433 Method of fabricating deep trench isolation structure in image sensor and device thereof Hsin-Hung Chen, Dun-Nian Yaung, Jen-Cheng Liu, Alexander Kalnitsky 2016-12-13
9455288 Image sensor structure to reduce cross-talk and improve quantum efficiency Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Jeng-Shyan Lin 2016-09-27
9401380 Backside structure and methods for BSI image sensors Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Keng-Yu Chou, Shuang-Ji Tsai +1 more 2016-07-26
9362329 Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Shuang-Ji Tsai, Yueh-Chiou Lin 2016-06-07
9356058 Backside structure for BSI image sensor Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Keng-Yu Chou, Shuang-Ji Tsai +1 more 2016-05-31
9355888 Implant isolated devices and method for forming the same Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wen-I Hsu 2016-05-31
9305966 Backside structure and method for BSI image sensors Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Keng-Yu Chou, Shuang-Ji Tsai +1 more 2016-04-05
9184207 Pad structures formed in double openings in dielectric layers Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Shuang-Ji Tsai, Yueh-Chiou Lin 2015-11-10
9177986 Isolation for semiconductor devices Wen-I Hsu, Min-Feng Kao, Jen-Cheng Liu, Dun-Nian Yaung, Tzu-Hsuan Hsu 2015-11-03
9165970 Back side illuminated image sensor having isolated bonding pads Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Hsiao-Hui Tseng 2015-10-20
9147703 CMOS image sensor structure Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang 2015-09-29
9142586 Pad design for backside illuminated image sensor Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin 2015-09-22
9142690 Semiconductor device having a bonding pad and shield structure and method of manufacturing the same Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Jeng-Shyan Lin, Cheng-Ying Ho 2015-09-22
9123615 Vertically integrated image sensor chips and methods for forming the same Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen +1 more 2015-09-01