Issued Patents All Time
Showing 1–25 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322694 | Metal-insulator-metal device with improved performance | Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin, Kuan-Hua Lin | 2025-06-03 |
| 12315843 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu +3 more | 2025-05-27 |
| 12300669 | Backside contact for thermal displacement in a multi-wafer stacked integrated circuit | Ping-Tzu Chen, Hsing-Chih Lin | 2025-05-13 |
| 12283564 | Semiconductor structure and manufacturing method thereof | Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin, Zheng-Xun Li | 2025-04-22 |
| 12278250 | Semiconductor device including image sensor and method of forming the same | Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin, Feng-Chi Hung, Shyh-Fann Ting | 2025-04-15 |
| 12230554 | Shield structure for backside through substrate vias (TSVs) | Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Wei-Tao Tsai | 2025-02-18 |
| 12218106 | Backside contact to improve thermal dissipation away from semiconductor devices | Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen +1 more | 2025-02-04 |
| 12218165 | Semiconductor image sensor and method of manufacturing the same | Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin, Che-Wei Chen | 2025-02-04 |
| 12218166 | CSI with controllable isolation structure and methods of manufacturing and using the same | Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Shih-Han Huang | 2025-02-04 |
| 12205868 | Oversized via as through-substrate-via (TSV) stop layer | Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen | 2025-01-21 |
| 12183761 | Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same | Sheng-Chau Chen, Cheng-Hsien Chou | 2024-12-31 |
| 12176370 | Stacked structure for CMOS image sensors including through-substrate-via contacting negative bias circuit | Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Sheng-Chau Chen, Feng-Chi Hung +1 more | 2024-12-24 |
| 12148781 | Image sensor device | Szu-Ying Chen, Jen-Cheng Liu, Feng-Chi Hung, Dun-Nian Yaung | 2024-11-19 |
| 12142569 | Integrated chip for standard logic performance improvement having a back-side through-substrate-via and method for forming the integrated chip | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang | 2024-11-12 |
| 12062679 | Backside structure for image sensor | Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Shih-Han Huang | 2024-08-13 |
| 12057446 | Stacked semiconductor device and method | Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin | 2024-08-06 |
| 12034037 | Backside capacitor techniques | Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu | 2024-07-09 |
| 12033919 | Backside or frontside through substrate via (TSV) landing on metal | Zheng-Xun Li, Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung | 2024-07-09 |
| 12009214 | Gate electrodes with notches and methods for forming the same | Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2024-06-11 |
| 11955428 | Semiconductor structure and manufacturing method thereof | Hsin-Hung Chen, Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung | 2024-04-09 |
| 11942368 | Through silicon vias and methods of fabricating thereof | Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung | 2024-03-26 |
| 11908878 | Image sensor and manufacturing method thereof | Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Sheng-Chau Chen, Feng-Chi Hung +1 more | 2024-02-20 |
| 11901387 | Image sensor | Dun-Nian Yaung, Jen-Cheng Liu, Wen-Chang Kuo, Sheng-Chau Chen, Feng-Chi Hung +1 more | 2024-02-13 |
| 11854959 | Metal-insulator-metal device with improved performance | Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin, Kuan-Hua Lin | 2023-12-26 |
| 11791332 | Stacked semiconductor device and method | Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin | 2023-10-17 |