Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283564 | Semiconductor structure and manufacturing method thereof | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin | 2025-04-22 |
| 12033919 | Backside or frontside through substrate via (TSV) landing on metal | Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung | 2024-07-09 |
| 11756920 | Semiconductor structure and manufacturing method thereof | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin | 2023-09-12 |