Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230554 | Shield structure for backside through substrate vias (TSVs) | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu | 2025-02-18 |
| 11764129 | Method of forming shield structure for backside through substrate vias (TSVS) | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu | 2023-09-19 |
| 11062977 | Shield structure for backside through substrate vias (TSVs) | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu | 2021-07-13 |