Issued Patents All Time
Showing 1–25 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12382744 | Stacked substrate structure with inter-tier interconnection | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Wei-Chih Weng, Yu-Yang Shen | 2025-08-05 |
| 12356749 | Image sensor device | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee | 2025-07-08 |
| 12324258 | Image sensor with improved quantum efficiency surface structure | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Shih-Hsun Hsu | 2025-06-03 |
| 12218173 | Image sensor device | Chia-Yu Wei, Yen-Liang Lin, Kuo-Cheng Lee, Hsin-Chi Chen | 2025-02-04 |
| 12191327 | CMOS image sensor having indented photodiode structure | Chia-Yu Wei, Hsin-Chi Chen, Kuo-Cheng Lee, Ping-Hao Lin, Yen-Liang Lin +1 more | 2025-01-07 |
| 12142569 | Integrated chip for standard logic performance improvement having a back-side through-substrate-via and method for forming the integrated chip | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu | 2024-11-12 |
| 12081866 | Image sensor including light shielding layer and patterned dielectric layer | Yun-Wei Cheng, Chun-Hao Chou, Hsin-Chi Chen, Kuo-Cheng Lee | 2024-09-03 |
| 12068271 | Semiconductor device structure and methods of forming the same | Hsin-Chi Chen, Chih-Ming Lee, Shang-Yen Wu, Chih-An Yang, Hung-Wei HO +2 more | 2024-08-20 |
| 12009323 | Semiconductor structure | Chia-Yu Wei, Cheng-Yuan Li, Yen-Liang Lin, Kuo-Cheng Lee, Hsin-Chi Chen | 2024-06-11 |
| 12010826 | Semiconductor device having a butted contact and method of forming | You Che CHUANG, Chih-Ming Lee, Hsin-Chi Chen | 2024-06-11 |
| 11855118 | Image sensor device | Chia-Yu Wei, Yen-Liang Lin, Kuo-Cheng Lee, Hsin-Chi Chen | 2023-12-26 |
| 11843007 | CMOS image sensor having indented photodiode structure | Chia-Yu Wei, Hsin-Chi Chen, Kuo-Cheng Lee, Ping-Hao Lin, Yen-Liang Lin +1 more | 2023-12-12 |
| 11824073 | Image sensor device | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee | 2023-11-21 |
| 11817472 | Anchor structures and methods for uniform wafer planarization and bonding | Chia-Yu Wei, Cheng-Yuan Li, Hsin-Chi Chen, Kuo-Cheng Lee, Yen-Liang Lin | 2023-11-14 |
| 11817470 | Stacked substrate structure with inter-tier interconnection | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Wei-Chih Weng, Yu-Yang Shen | 2023-11-14 |
| 11784198 | Wide channel semiconductor device | Chia-Yu Wei, Fu-Cheng Chang, Hsin-Chi Chen, Ching-Hung Kao, Chia-Pin Cheng +2 more | 2023-10-10 |
| 11756913 | Semiconductor device structure and methods of forming the same | Hsin-Chi Chen, Chih-Ming Lee, Shang-Yen Wu, Chih-An Yang, Hung-Wei HO +2 more | 2023-09-12 |
| 11706525 | Image sensor including light shielding layer and patterned dielectric layer | Yun-Wei Cheng, Chun-Hao Chou, Hsin-Chi Chen, Kuo-Cheng Lee | 2023-07-18 |
| 11610901 | Semiconductor device having a butted contact, method of forming and method of using | You Che CHUANG, Chih-Ming Lee, Hsin-Chi Chen | 2023-03-21 |
| 11532662 | Method of forming image sensor device | Chia-Yu Wei, Yen-Liang Lin, Kuo-Cheng Lee, Hsin-Chi Chen | 2022-12-20 |
| 11456263 | Semiconductor structure and method for forming the same | Chia-Yu Wei, Cheng-Yuan Li, Yen-Liang Lin, Kuo-Cheng Lee, Hsin-Chi Chen | 2022-09-27 |
| 11380721 | Wide channel gate structure | Chia-Yu Wei, Fu-Cheng Chang, Hsin-Chi Chen, Ching-Hung Kao, Chia-Pin Cheng +2 more | 2022-07-05 |
| 11373971 | Semiconductor device structure and methods of forming the same | Hsin-Chi Chen, Chih-Ming Lee, Shang-Yen Wu, Chih-An Yang, Hung-Wei HO +2 more | 2022-06-28 |
| 11302738 | Image sensor with improved quantum efficiency surface structure | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Shih-Hsun Hsu | 2022-04-12 |
| 11244925 | Semiconductor device structure with back-side layer to reduce leakage | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Jeng-Shyan Lin | 2022-02-08 |