Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12364049 | Semiconductor device | Yu-Chien Ku, Huai-Jen Tung, Keng-Ying Liao, Yi-Hung Chen, Yi Yang | 2025-07-15 |
| 12324258 | Image sensor with improved quantum efficiency surface structure | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Hsun-Ying Huang | 2025-06-03 |
| 12155258 | Method for controlling power supplies | Chih-Cherng LU, Te-Lung Chen, Chia-Ching Ting, Chen-Syuan Wong | 2024-11-26 |
| 12021099 | Embedded light shield structure for CMOS image sensor | Ping-Hao Lin | 2024-06-25 |
| 11901390 | Semiconductor device | Yu-Chien Ku, Huai-Jen Tung, Keng-Ying Liao, Yi-Hung Chen, Yi Yang | 2024-02-13 |
| 11791356 | Image sensor device having a first lens and a second lens over the first lens | — | 2023-10-17 |
| 11302738 | Image sensor with improved quantum efficiency surface structure | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Hsun-Ying Huang | 2022-04-12 |
| 11222913 | Image sensor device having first lens over a light-sensing region and surrounded by a grid layer | — | 2022-01-11 |
| 11189657 | Image sensor with improved quantum efficiency surface structure | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Hsun-Ying Huang | 2021-11-30 |
| 11177308 | CMOS sensors and methods of forming the same | Yu-Chien Ku, Huai-Jen Tung, Keng-Ying Liao, Yi-Hung Chen, Yi Yang | 2021-11-16 |
| 10665627 | Image sensor device and method for forming the image sensor device having a first lens and a second lens over the first lens | — | 2020-05-26 |
| 10644060 | Image sensor with high quantum efficiency surface structure | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Hsun-Ying Huang | 2020-05-05 |
| 10522585 | Method for manufacturing CMOS image sensor | Yi Yang, Yi-Hung Chen, Keng-Ying Liao, Yi-Jie Chen, Chun-Chi Lee | 2019-12-31 |
| 10283548 | CMOS sensors and methods of forming the same | Yu-Chien Ku, Huai-Jen Tung, Keng-Ying Liao, Yi-Hung Chen, Yi Yang | 2019-05-07 |
| 9601443 | Test structure for seal ring quality monitor | Hao-Yi Tsai, Shih-Cheng Chang, Shang-Yun Hou, Hsien-Wei Chen, Chia-Lun Tsai +3 more | 2017-03-21 |
| 8993355 | Test line placement to improve die sawing quality | Hao-Yi Tsai, Chia-Lun Tsai, Shang-Yun Hou, Shin-Puu Jeng, Wei-Ti Hsu +2 more | 2015-03-31 |
| 8772137 | Semiconductor wafer with assisting dicing structure and dicing method thereof | Hsien-Wei Chen | 2014-07-08 |
| 8749020 | Metal e-fuse structure design | Hsien-Wei Chen, Hao-Yi Tsai, Shin-Puu Jeng | 2014-06-10 |
| 8643147 | Seal ring structure with improved cracking protection and reduced problems | Shin-Puu Jeng, Shang-Yun Hou, Hao-Yi Tsai, Chen-Hua Yu | 2014-02-04 |
| 8629532 | Semiconductor wafer with assisting dicing structure and dicing method thereof | Hsien-Wei Chen | 2014-01-14 |
| 8519512 | Test line placement to improve die sawing quality | Hao-Yi Tsai, Chia-Lun Tsai, Shang-Yun Hou, Shin-Puu Jeng, Wei-Ti Hsu +2 more | 2013-08-27 |
| 8227917 | Bond pad design for fine pitch wire bonding | Hao-Yi Tsai, Benson Liu, Chia-Lun Tsai, Hsien-Wei Chen, Anbiarshy Wu +2 more | 2012-07-24 |
| 8125052 | Seal ring structure with improved cracking protection | Shin-Puu Jeng, Shang-Yun Hou, Hao-Yi Tsai, Chen-Hua Yu | 2012-02-28 |
| 8125233 | Parametric testline with increased test pattern areas | Hsien-Wei Chen, Hao-Yi Tsai, Shin-Puu Jeng | 2012-02-28 |
| 8072076 | Bond pad structures and integrated circuit chip having the same | Shih-Puu Jeng, Shang-Yun Hou, Hsien-Wei Chen | 2011-12-06 |