Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7884473 | Method and structure for increased wire bond density in packages for semiconductor chips | Hsien-Wei Chen | 2011-02-08 |
| 7834351 | Semiconductor device | Hsien-Wei Chen, Hsueh-Chung Chen | 2010-11-16 |
| 7714443 | Pad structure design with reduced density | Hsien-Wei Chen, Anbiarshy Wu, Shang-Yun Hou, Hsueh-Chung Chen, Shin-Puu Jeng | 2010-05-11 |
| 7692274 | Reinforced semiconductor structures | Hsien-Wei Chen | 2010-04-06 |
| 7679384 | Parametric testline with increased test pattern areas | Hsien-Wei Chen, Hao-Yi Tsai, Shin-Puu Jeng | 2010-03-16 |
| 7646078 | Die saw crack stopper | Shin-Puu Jeng | 2010-01-12 |
| 7538346 | Semiconductor device | Hsien-Wei Chen, Hsueh-Chung Chen | 2009-05-26 |
| 7235424 | Method and apparatus for enhanced CMP planarization using surrounded dummy design | Hsien-Wei Chen, Hao-Yi Tsai, Hsueh-Chung Chen, Shin-Puu Jeng, Jian-Hong Lin +1 more | 2007-06-26 |
| 6797190 | Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same | Chia-Lin Hsu, Art Yu, Hsueh-Chung Chen | 2004-09-28 |
| 6709544 | Chemical mechanical polishing equipment | Shao-Chung Hu, Chia-Lin Hsu, Hsueh-Chung Chen | 2004-03-23 |
| 6660627 | Method for planarization of wafers with high selectivities | Shao-Chung Hu, Hsueh-Chung Chen, Chia-Lin Hsu | 2003-12-09 |
| 6638391 | Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same | Chia-Lin Hsu, Art Yu, Hsueh-Chung Chen | 2003-10-28 |