Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11940737 | Method of fabricating reticle | Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu +4 more | 2024-03-26 |
| 11003091 | Method of fabricating reticle | Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu +4 more | 2021-05-11 |
| 10534272 | Method of fabricating reticle | Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu +4 more | 2020-01-14 |
| 10073354 | Exposure method of wafer substrate, manufacturing method of semiconductor device, and exposure tool | Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu +4 more | 2018-09-11 |
| 8993355 | Test line placement to improve die sawing quality | Hao-Yi Tsai, Chia-Lun Tsai, Shang-Yun Hou, Shin-Puu Jeng, Shih-Hsun Hsu +2 more | 2015-03-31 |
| 8519512 | Test line placement to improve die sawing quality | Hao-Yi Tsai, Chia-Lun Tsai, Shang-Yun Hou, Shin-Puu Jeng, Shih-Hsun Hsu +2 more | 2013-08-27 |