Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12376417 | Semiconductor device with nanostructures | Hsin-Hsiang Tseng, Chih-Fei Lee, Chia-Pin Cheng | 2025-07-29 |
| 12243772 | Protection structures for bonded wafers | Ssu-Chiang Weng, Ping-Hao Lin | 2025-03-04 |
| 12125864 | Image sensor and method of making | Po-Han Chen, Chen-Chun Chen, Kuo-Cheng Lee | 2024-10-22 |
| 12107104 | Backside refraction layer for backside illuminated image sensor and methods of forming the same | Po-Han Chen, Kuo-Cheng Lee | 2024-10-01 |
| 11901305 | Method for fabricating semiconductor structure having alignment mark feature | Kuo-Hung Lee, Chih-Fei Lee, Ching-Hung Kao | 2024-02-13 |
| 11791205 | Protection structures for bonded wafers | Ssu-Chiang Weng, Ping-Hao Lin | 2023-10-17 |
| 11784198 | Wide channel semiconductor device | Chia-Yu Wei, Hsin-Chi Chen, Ching-Hung Kao, Chia-Pin Cheng, Kuo-Cheng Lee +2 more | 2023-10-10 |
| 11777040 | Semiconductor device with nanostructures | Hsin-Hsiang Tseng, Chih-Fei Lee, Chia-Pin Cheng | 2023-10-03 |
| 11764062 | Method of forming semiconductor structure | Ping-Hao Lin | 2023-09-19 |
| 11676980 | Image sensor and method of making | Po-Han Chen, Chen-Chun Chen, Kuo-Cheng Lee | 2023-06-13 |
| 11664403 | Manufacturing method of image sensor device having metal grid partially embedded in buffer layer | Zen-Fong Huang | 2023-05-30 |
| 11581349 | Backside refraction layer for backside illuminated image sensor and methods of forming the same | Po-Han Chen, Kuo-Cheng Lee | 2023-02-14 |
| 11515435 | Semiconductor device with nanostructures and methods of forming the same | Hsin-Hsiang Tseng, Chih-Fei Lee, Chia-Pin Cheng | 2022-11-29 |
| 11380721 | Wide channel gate structure | Chia-Yu Wei, Hsin-Chi Chen, Ching-Hung Kao, Chia-Pin Cheng, Kuo-Cheng Lee +2 more | 2022-07-05 |
| 11362039 | Semiconductor structure and fabricating method thereof | Kuo-Hung Lee, Chih-Fei Lee, Ching-Hung Kao | 2022-06-14 |
| 11004733 | Protection structures for bonded wafers | Ssu-Chiang Weng, Ping-Hao Lin | 2021-05-11 |
| 10804211 | Semiconductor structure and fabricating method thereof | Kuo-Hung Lee, Chih-Fei Lee, Ching-Hung Kao | 2020-10-13 |
| 10804414 | Semiconductor device with nanostructures and methods of forming the same | Hsin-Hsiang Tseng, Chih-Fei Lee, Chia-Pin Cheng | 2020-10-13 |
| 10566361 | Wide channel gate structure and method of forming | Chia-Yu Wei, Hsin-Chi Chen, Ching-Hung Kao, Chia-Pin Cheng, Kuo-Cheng Lee +2 more | 2020-02-18 |
| 10269990 | Semiconductor device with nanostructures and methods of forming the same | Hsin-Hsiang Tseng, Chih-Fei Lee, Chia-Pin Cheng | 2019-04-23 |
| 10170515 | Implantation process for semiconductor device | Che-Chun Lu, Ching-Hung Kao, Chia-Pin Cheng, Po-Chun Chiu | 2019-01-01 |
| 10157941 | Image sensor and fabrication method thereof | Chia-Pin Cheng, Ching-Hung Kao, Che-Chun Lu | 2018-12-18 |
| 10157950 | Pixel with spacer layer covering photodiode | Kuo-Hung Lee, Chia-Pin Cheng, Volume Chien, Ching-Hung Kao | 2018-12-18 |
| 10134694 | Method of forming redistribution layer | Chih-Fei Lee, Chi-Cherng Jeng, Hsin-Chi Chen, Yuan-Ko Hwang | 2018-11-20 |
| 10115758 | Isolation structure for reducing crosstalk between pixels and fabrication method thereof | Kai-Yi Chen, Chih-Fei Lee, Ching-Hung Kao, Chia-Pin Cheng | 2018-10-30 |