YH

Yuan-Ko Hwang

TSMC: 25 patents #1,360 of 12,232Top 15%
VS Vanguard International Semiconductor: 1 patents #340 of 585Top 60%
Overall (All Time): #143,636 of 4,157,543Top 4%
27
Patents All Time

Issued Patents All Time

Showing 1–25 of 27 patents

Patent #TitleCo-InventorsDate
11935951 Metal-insensitive epitaxy formation Chun Hsiung Tsai 2024-03-19
11495685 Metal-insensitive epitaxy formation Chun Hsiung Tsai 2022-11-08
10804395 Metal-insensitive epitaxy formation Chun Hsiung Tsai 2020-10-13
10263108 Metal-insensitive epitaxy formation Chun Hsiung Tsai 2019-04-16
10134694 Method of forming redistribution layer Chih-Fei Lee, Fu-Cheng Chang, Chi-Cherng Jeng, Hsin-Chi Chen 2018-11-20
9373594 Under bump metallization Chih-Fei Lee, Fu-Cheng Chang, Chi-Cherng Jeng, Hsin-Chi Chen 2016-06-21
7576374 Semiconductor device with robust polysilicon fuse Yuan-Pang Lee, Chen-Shiang Shieh, Ping-Hung Yin, Fei-Yun Chen 2009-08-18
7384799 Method to avoid amorphous-si damage during wet stripping processes in the manufacture of MEMS devices Fei-Yun Chen, Ni-Hwi Kuan, Yuh-Hwa Chang, Yuan-Pang Lee, Shuh-Shun Chen 2008-06-10
7144673 Effective photoresist stripping process for high dosage and high energy ion implantation Fei-Yun Chen, Jen-Shian Shieh, Hao Yuan, Shih-Shiung Chen 2006-12-05
7083897 Method of fabricating a poly fuse Yuan-Pang Lee, Chen-Shiang Shieh, Ping-Hung Yin, Fei-Yun Chen 2006-08-01
6908813 Method of forming tiny silicon nitride spacer for flash EPROM by fully wet etching technology Hung-Hsin Liu, Kuei-Jen Chang, Tsung-Chi Hsieh, Shih Chiung Chen 2005-06-21
6723654 Method and apparatus for in-situ descum/hot bake/dry etch photoresist/polyimide layer Kuei-Jen Chang, Juei-Wen Lin, Jen-Yung Tseng 2004-04-20
6706601 Method of forming tiny silicon nitride spacer for flash EPROM by using dry+wet etching technology Hung-Hsin Liu, Kwang-Chen Wu, How-Cheng Tsai, Shih-Shun Chen 2004-03-16
6617221 Method of making capacitors Hao Yuan, Nan-Huan Kuan, Shih-Shiung Chen 2003-09-09
6489227 Method of etching a polysilicon layer during the stripping of the photoresist shape used as an etch mask to create an opening to an underlying fuse structure Tsung-Chi Hsieh, Juei-Wen Lin, Kuei-Jen Chang 2002-12-03
6256825 Removal of particulate contamination in loadlocks 2001-07-10
6238160 Method for transporting and electrostatically chucking a semiconductor wafer or the like Tsung-Chi Hsieh 2001-05-29
6232172 Method to prevent auto-doping induced threshold voltage shift Sen-Fu Chen, Huan-Wen Wang 2001-05-15
6185085 System for transporting and electrostatically chucking a semiconductor wafer or the like Tsung-Chi Hsieh 2001-02-06
6157867 Method and system for on-line monitoring plasma chamber condition by comparing intensity of certain wavelength Ching-Wen Cho 2000-12-05
6117348 Real time monitoring of plasma etching process YUNG-SUNG PENG, Tsung Tser Lee, Jeng Kuen Lu 2000-09-12
6030489 Apparatus for controlling etch rate when using consumable electrodes during plasma etching 2000-02-29
6024831 Method and apparatus for monitoring plasma chamber condition by observing plasma stability Ying-Chen Chao 2000-02-15
6024828 Spin-on-glass etchback uniformity improvement using hot backside helium 2000-02-15
5955383 Method for controlling etch rate when using consumable electrodes during plasma etching 1999-09-21