CL

Chih-Fei Lee

TSMC: 12 patents #2,442 of 12,232Top 20%
📍 Tainan, TW: #533 of 4,566 inventorsTop 15%
Overall (All Time): #399,222 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
12376417 Semiconductor device with nanostructures Hsin-Hsiang Tseng, Chia-Pin Cheng, Fu-Cheng Chang 2025-07-29
11901305 Method for fabricating semiconductor structure having alignment mark feature Kuo-Hung Lee, Fu-Cheng Chang, Ching-Hung Kao 2024-02-13
11777040 Semiconductor device with nanostructures Hsin-Hsiang Tseng, Chia-Pin Cheng, Fu-Cheng Chang 2023-10-03
11515435 Semiconductor device with nanostructures and methods of forming the same Hsin-Hsiang Tseng, Chia-Pin Cheng, Fu-Cheng Chang 2022-11-29
11362039 Semiconductor structure and fabricating method thereof Kuo-Hung Lee, Fu-Cheng Chang, Ching-Hung Kao 2022-06-14
10804414 Semiconductor device with nanostructures and methods of forming the same Hsin-Hsiang Tseng, Chia-Pin Cheng, Fu-Cheng Chang 2020-10-13
10804211 Semiconductor structure and fabricating method thereof Kuo-Hung Lee, Fu-Cheng Chang, Ching-Hung Kao 2020-10-13
10269990 Semiconductor device with nanostructures and methods of forming the same Hsin-Hsiang Tseng, Chia-Pin Cheng, Fu-Cheng Chang 2019-04-23
10134694 Method of forming redistribution layer Fu-Cheng Chang, Chi-Cherng Jeng, Hsin-Chi Chen, Yuan-Ko Hwang 2018-11-20
10115758 Isolation structure for reducing crosstalk between pixels and fabrication method thereof Kai-Yi Chen, Fu-Cheng Chang, Ching-Hung Kao, Chia-Pin Cheng 2018-10-30
10020265 Semiconductor structure and fabricating method thereof Kuo-Hung Lee, Fu-Cheng Chang, Ching-Hung Kao 2018-07-10
9373594 Under bump metallization Fu-Cheng Chang, Chi-Cherng Jeng, Hsin-Chi Chen, Yuan-Ko Hwang 2016-06-21