Issued Patents All Time
Showing 26–50 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11233082 | Formation method of light sensing device | Yun-Wei Cheng, Yi-Hsing Chu, Yin-Chieh Huang, Chun-Hao Chou, Kuo-Cheng Lee +1 more | 2022-01-25 |
| 11189743 | Single photon avalanche diode | Chia-Yu Wei, Yu-Ting Kao, Yen-Liang Lin, Wen-I Hsu, Kuo-Cheng Lee +1 more | 2021-11-30 |
| 11189657 | Image sensor with improved quantum efficiency surface structure | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Shih-Hsun Hsu | 2021-11-30 |
| 11183523 | CMOS image sensor having indented photodiode structure | Chia-Yu Wei, Hsin-Chi Chen, Kuo-Cheng Lee, Ping-Hao Lin, Yen-Liang Lin +1 more | 2021-11-23 |
| 11177304 | Method for forming light-sensing device | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee | 2021-11-16 |
| 11177305 | Method for fabricating image sensor | Yun-Wei Cheng, Yin-Chieh Huang, Chun-Hao Chou, Kuo-Cheng Lee | 2021-11-16 |
| 11177307 | Stacked semiconductor dies with a conductive feature passing through a passivation layer | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu | 2021-11-16 |
| 11177309 | Image sensor with pad structure | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Yin-Chieh Huang | 2021-11-16 |
| 11164902 | Image sensor having isolation structure | Yun-Wei Cheng, Chun-Wei CHIA, Chun-Hao Chou, Kuo-Cheng Lee | 2021-11-02 |
| 11152417 | Anchor structures and methods for uniform wafer planarization and bonding | Chia-Yu Wei, Cheng-Yuan Li, Hsin-Chi Chen, Kuo-Cheng Lee, Yen-Liang Lin | 2021-10-19 |
| 11140309 | Image sensor including light shielding layer and patterned dielectric layer | Yun-Wei Cheng, Chun-Hao Chou, Hsin-Chi Chen, Kuo-Cheng Lee | 2021-10-05 |
| 11107767 | Structure for standard logic performance improvement having a back-side through-substrate-via | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu | 2021-08-31 |
| 11088188 | Image sensor device | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee | 2021-08-10 |
| 11043522 | Stacked substrate structure with inter-tier interconnection | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Wei-Chih Weng, Yu-Yang Shen | 2021-06-22 |
| 11031426 | Image sensor having grid isolation structure | Yun-Wei Cheng, Yin-Chieh Huang, Chun-Hao Chou, Kuo-Cheng Lee | 2021-06-08 |
| 10943942 | Image sensor device and method of forming the same | Chia-Yu Wei, Yen-Liang Lin, Kuo-Cheng Lee, Hsin-Chi Chen | 2021-03-09 |
| 10861859 | Memory cells with butted contacts and method of forming same | You Che CHUANG, Chih-Ming Lee, Hsin-Chi Chen | 2020-12-08 |
| 10790265 | Semiconductor device structure with back-side layer to reduce leakage | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Jeng-Shyan Lin | 2020-09-29 |
| 10790321 | CMOS image sensor having indented photodiode structure | Chia-Yu Wei, Hsin-Chi Chen, Kuo-Cheng Lee, Ping-Hao Lin, Yen-Liang Lin +1 more | 2020-09-29 |
| 10790327 | Semiconductor device structure with a conductive feature passing through a passivation layer | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu | 2020-09-29 |
| 10714523 | Isolation structure and image sensor | Yun-Wei Cheng, Chun-Wei CHIA, Chun-Hao Chou, Kuo-Cheng Lee | 2020-07-14 |
| 10692826 | Semiconductor structure and method for forming the same | Chia-Yu Wei, Cheng-Yuan Li, Yen-Liang Lin, Kuo-Cheng Lee, Hsin-Chi Chen | 2020-06-23 |
| 10680027 | Stacked semiconductor dies with a conductive feature passing through a passivation layer | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu | 2020-06-09 |
| 10651217 | Structure and formation method of light sensing device | Yun-Wei Cheng, Yi-Hsing Chu, Yin-Chieh Huang, Chun-Hao Chou, Kuo-Cheng Lee +1 more | 2020-05-12 |
| 10644060 | Image sensor with high quantum efficiency surface structure | Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Shih-Hsun Hsu | 2020-05-05 |