Issued Patents All Time
Showing 51–75 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916502 | Semiconductor device and manufacturing method thereof | Hsin-Hung Chen, Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung | 2021-02-09 |
| 10910420 | Semiconductor switching device separate by device isolation | Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2021-02-02 |
| 10861899 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu +1 more | 2020-12-08 |
| 10811398 | Semiconductor structure and method for manufacturing the same | Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin, Ching-Chun Wang | 2020-10-20 |
| 10804155 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu | 2020-10-13 |
| 10790327 | Semiconductor device structure with a conductive feature passing through a passivation layer | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang | 2020-09-29 |
| 10790194 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu | 2020-09-29 |
| 10790265 | Semiconductor device structure with back-side layer to reduce leakage | Dun-Nian Yaung, Jen-Cheng Liu, Jeng-Shyan Lin, Hsun-Ying Huang | 2020-09-29 |
| 10763292 | Interconnect apparatus and method for a stacked semiconductor device | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +2 more | 2020-09-01 |
| 10734428 | Image sensor device | Szu-Ying Chen, Jen-Cheng Liu, Feng-Chi Hung, Dun-Nian Yaung | 2020-08-04 |
| 10734423 | Semiconductor switching device separated by device isolation | Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2020-08-04 |
| 10727164 | Semiconductor structure and manufacturing method for the same | Dun-Nian Yaung, Jen-Cheng Liu, Ching-Chun Wang, Kuan-Chieh Huang, Hsing-Chih Lin +1 more | 2020-07-28 |
| 10727205 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu +3 more | 2020-07-28 |
| 10680027 | Stacked semiconductor dies with a conductive feature passing through a passivation layer | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang | 2020-06-09 |
| 10622401 | Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same | Sheng-Chau Chen, Cheng-Hsien Chou | 2020-04-14 |
| 10566288 | Structure for standard logic performance improvement having a back-side through-substrate-via | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang | 2020-02-18 |
| 10535706 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu +1 more | 2020-01-14 |
| 10535697 | Structure and method for 3D Image sensor | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2020-01-14 |
| 10515994 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2019-12-24 |
| 10510592 | Integrated circuit (IC) structure for high performance and functional density | Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Kuan-Chieh Huang | 2019-12-17 |
| 10510542 | Gate electrodes with notches and methods for forming the same | Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2019-12-17 |
| 10504784 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu | 2019-12-10 |
| 10468441 | Semiconductor switching device separated by device isolation | Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2019-11-05 |
| 10283550 | Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same | Sheng-Chau Chen, Cheng-Hsien Chou | 2019-05-07 |
| 10276619 | Semiconductor device structure with a conductive feature passing through a passivation layer | Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang | 2019-04-30 |