Issued Patents All Time
Showing 1–25 of 122 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426335 | Reducing k values of dielectric films through anneal | Wen-Kai Lin, Che-Hao Chang, Chi On Chui, Yung-Cheng Lu | 2025-09-23 |
| 12424605 | Hybrid bonding with uniform pattern density | Dun-Nian Yaung | 2025-09-23 |
| 12419100 | Transistor isolation regions and methods of forming the same | Sen-Hong Syue, Huicheng Chang, Yee-Chia Yeo | 2025-09-16 |
| 12389662 | Formation method of shallow trench isolation | Chia-Cheng Chen, Liang-Yin Chen, Sen-Hong Syue | 2025-08-12 |
| 12381195 | Semiconductor devices and methods of manufacture thereof | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen | 2025-08-05 |
| 12369394 | Semiconductor device and method of forming same | Sen-Hong Syue, Li-Ting Wang, Huicheng Chang, Yee-Chia Yeo | 2025-07-22 |
| 12336249 | Gate spacer and formation method thereof | Yi-Rui Chen, Yi-Fan Chen, Sen-Hong Syue, Huicheng Chang, Yee-Chia Yeo | 2025-06-17 |
| 12206012 | Reducing K values of dielectric films through anneal | Wen-Kai Lin, Che-Hao Chang, Chi On Chui, Yung-Cheng Lu | 2025-01-21 |
| 12183573 | Device and method for high pressure anneal | Ya-Wen Chiu, Cheng-Po Chau, Yi Che Chan, Chih Ping Liao, YungHao Wang +1 more | 2024-12-31 |
| 12148781 | Image sensor device | Min-Feng Kao, Jen-Cheng Liu, Feng-Chi Hung, Dun-Nian Yaung | 2024-11-19 |
| 12087847 | Variable size fin structures | Su-Hao Liu, Huicheng Chang, Chien-Tai Chan, Liang-Yin Chen, Yee-Chia Yeo | 2024-09-10 |
| 12068287 | Stacked semiconductor structure and method | Meng-Hsun Wan, Dun-Nian Yaung | 2024-08-20 |
| 12046479 | Nitride-containing STI liner for SiGe channel | Ya-Wen Chiu, Lun-Kuang Tan | 2024-07-23 |
| 12009214 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2024-06-11 |
| 11996412 | Semiconductor device and method of forming same | Sen-Hong Syue, Li-Ting Wang, Huicheng Chang, Yee-Chia Yeo | 2024-05-28 |
| 11996399 | Hybrid bonding with uniform pattern density | Dun-Nian Yaung | 2024-05-28 |
| 11978758 | Methods and apparatus for via last through-vias | Pao-Tung Chen, Dun-Nian Yaung, Jen-Cheng Liu | 2024-05-07 |
| 11978676 | Semiconductor structure and method of forming the same | Po-Kang Ho, Sen-Hong Syue, Huicheng Chang, Yee-Chia Yeo | 2024-05-07 |
| 11908751 | Transistor isolation regions and methods of forming the same | Sen-Hong Syue, Huicheng Chang, Yee-Chia Yeo | 2024-02-20 |
| 11901218 | Shallow trench isolation forming method and structures resulting therefrom | Sen-Hong Syue, Huicheng Chang, Yee-Chia Yeo | 2024-02-13 |
| 11854800 | Device and method for high pressure anneal | Ya-Wen Chiu, Cheng-Po Chau, Yi Che Chan, Chih Ping Liao, YungHao Wang +1 more | 2023-12-26 |
| 11640986 | Implantation and annealing for semiconductor device | Yu-Chang Lin, Tien-Shun Chang, Chun-Feng Nieh, Sen-Hong Syue, Huicheng Chang | 2023-05-02 |
| 11605635 | Semiconductor device and method of forming same | Sen-Hong Syue, Li-Ting Wang, Huicheng Chang, Yee-Chia Yeo | 2023-03-14 |
| 11600653 | Methods and apparatus for via last through-vias | Pao-Tung Chen, Dun-Nian Yaung, Jen-Cheng Liu | 2023-03-07 |
| 11587910 | Stacked semiconductor structure and method | Meng-Hsun Wan, Dun-Nian Yaung | 2023-02-21 |