Issued Patents All Time
Showing 26–50 of 122 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502121 | Image sensor device | Min-Feng Kao, Jen-Cheng Liu, Feng-Chi Hung, Dun-Nian Yaung | 2022-11-15 |
| 11456176 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2022-09-27 |
| 11380782 | Variable size fin structures | Su-Hao Liu, Huicheng Chang, Chien-Tai Chan, Liang-Yin Chen, Yee-Chia Yeo | 2022-07-05 |
| 11379722 | Method for training generative adversarial network (GAN), method for generating images by using GAN, and computer readable storage medium | Edward Chang, Che-Han Chang, Chun-Hsien Yu | 2022-07-05 |
| 11302567 | Shallow trench isolation forming method and structures resulting therefrom | Sen-Hong Syue, Huicheng Chang, Yee-Chia Yeo | 2022-04-12 |
| 11257805 | Hybrid bonding with uniform pattern density | Dun-Nian Yaung | 2022-02-22 |
| 11056573 | Implantation and annealing for semiconductor device | Yu-Chang Lin, Tien-Shun Chang, Chun-Feng Nieh, Sen-Hong Syue, Huicheng Chang | 2021-07-06 |
| 11037909 | Stacked semiconductor structure and method | Meng-Hsun Wan, Dun-Nian Yaung | 2021-06-15 |
| 11037781 | Device and method for high pressure anneal | Ya-Wen Chiu, Cheng-Po Chau, Yi Che Chan, Chih Ping Liao, YungHao Wang +1 more | 2021-06-15 |
| 10991752 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang +1 more | 2021-04-27 |
| 10930699 | Method and apparatus for image sensor packaging | Meng-Hsun Wan, Dun-Nian Yaung, Pao-Tung Chen, Jen-Cheng Liu | 2021-02-23 |
| 10910420 | Semiconductor switching device separate by device isolation | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wei-Cheng Hsu +1 more | 2021-02-02 |
| 10763292 | Interconnect apparatus and method for a stacked semiconductor device | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +2 more | 2020-09-01 |
| 10734428 | Image sensor device | Min-Feng Kao, Jen-Cheng Liu, Feng-Chi Hung, Dun-Nian Yaung | 2020-08-04 |
| 10734423 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wei-Cheng Hsu +1 more | 2020-08-04 |
| 10510790 | High-k dielectric liners in shallow trench isolations | Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2019-12-17 |
| 10510730 | Stacked semiconductor structure and method | Meng-Hsun Wan, Dun-Nian Yaung | 2019-12-17 |
| 10510793 | Uniform-size bonding patterns | Dun-Nian Yaung | 2019-12-17 |
| 10510791 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Pao-Tung Chen, Jen-Cheng Liu, Dun-Nian Yaung | 2019-12-17 |
| 10510912 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Dun-Nian Yaung, Jen-Cheng Liu, Bruce C. S. Chou +2 more | 2019-12-17 |
| 10510542 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2019-12-17 |
| 10475843 | Method and apparatus for image sensor packaging | Meng-Hsun Wan, Dun-Nian Yaung, Pao-Tung Chen, Jen-Cheng Liu | 2019-11-12 |
| 10468441 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wei-Cheng Hsu +1 more | 2019-11-05 |
| 10388642 | Hybrid bonding with uniform pattern density | Dun-Nian Yaung | 2019-08-20 |
| 10361233 | High-k dielectric liners in shallow trench isolations | Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2019-07-23 |