Issued Patents All Time
Showing 51–75 of 122 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10304818 | Method of manufacturing semiconductor devices having conductive plugs with varying widths | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen | 2019-05-28 |
| 10297632 | Method for an image sensor device | Chun-Han Chen, Dun-Nian Yaung | 2019-05-21 |
| 10269863 | Methods and apparatus for via last through-vias | Pao-Tung Chen, Dun-Nian Yaung, Jen-Cheng Liu | 2019-04-23 |
| 10170512 | Uniform-size bonding patterns | Dun-Nian Yaung | 2019-01-01 |
| 10163951 | Image sensor device | Min-Feng Kao, Jen-Cheng Liu, Feng-Chi Hung, Dun-Nian Yaung | 2018-12-25 |
| 10163956 | Interconnect apparatus and method | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +2 more | 2018-12-25 |
| 10164133 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Dun-Nian Yaung, Jen-Cheng Liu, Bruce C. S. Chou +2 more | 2018-12-25 |
| 10157889 | Stacked semiconductor structure and method | Meng-Hsun Wan, Dun-Nian Yaung | 2018-12-18 |
| 10157958 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang +1 more | 2018-12-18 |
| 10141358 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wei-Cheng Hsu +1 more | 2018-11-27 |
| 10096645 | Method and apparatus for image sensor packaging | Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung +1 more | 2018-10-09 |
| 10090349 | CMOS image sensor chips with stacked scheme and methods for forming the same | Meng-Hsun Wan, Dun-Nian Yaung, Jen-Cheng Liu | 2018-10-02 |
| 10062721 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Pao-Tung Chen, Jen-Cheng Liu, Dun-Nian Yaung | 2018-08-28 |
| 9960142 | Hybrid bonding with air-gap structure | Dun-Nian Yaung | 2018-05-01 |
| 9960129 | Hybrid bonding mechanisms for semiconductor wafers | Ping-Yin Liu, Chen-Jong Wang, Chih-Hui Huang, Xin-Hua Huang, Lan-Lin Chao +3 more | 2018-05-01 |
| 9941249 | Multi-wafer stacking by Ox-Ox bonding | Shu-Ting Tsai, Jeng-Shyan Lin, Tzu-Hsuan Hsu, Feng-Chi Hung, Dun-Nian Yaung | 2018-04-10 |
| 9917123 | Method and apparatus for image sensor packaging | Tzu-Jui Wang, Dun-Nian Yaung, Jen-Cheng Liu | 2018-03-13 |
| 9905426 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2018-02-27 |
| 9884271 | Filter structure | — | 2018-02-06 |
| 9859322 | Methods and apparatus for glass removal in CMOS image sensors | Pao-Tung Chen, Dun-Nian Yaung, Jen-Cheng Liu | 2018-01-02 |
| 9853082 | Color filter array and micro-lens structure for imaging system | Dun-Nian Yaung, Chen-Jong Wang, Tzu-Hsuan Hsu | 2017-12-26 |
| 9847368 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang +1 more | 2017-12-19 |
| 9847364 | Image sensor devices and design and manufacturing methods thereof | Chun-Han Chen, Dun-Nian Yaung | 2017-12-19 |
| 9748304 | Image sensor devices, methods of manufacture thereof, and semiconductor device manufacturing methods | U-Ting Chen, Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu | 2017-08-29 |
| 9722109 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Dun-Nian Yaung, Jen-Cheng Liu, Bruce C. S. Chou +2 more | 2017-08-01 |