Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381195 | Semiconductor devices and methods of manufacture thereof | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen | 2025-08-05 |
| 11916091 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, Shu-Ting Tsai, Hsiu-Yu Cheng | 2024-02-27 |
| 11798916 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Chia-Chieh Lin | 2023-10-24 |
| 11315972 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, Shu-Ting Tsai, Hsiu-Yu Cheng | 2022-04-26 |
| 10847560 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, Shu-Ting Tsai, Hsiu-Yu Cheng | 2020-11-24 |
| 10818720 | Stacked image sensor having a barrier layer | Shu-Ting Tsai, Cheng-Ying Ho, Tzu-Hsuan Hsu, Shih Pei Chou | 2020-10-27 |
| 10510729 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou | 2019-12-17 |
| 10304818 | Method of manufacturing semiconductor devices having conductive plugs with varying widths | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen | 2019-05-28 |
| 10283547 | Stacked image sensor having a barrier layer | Shu-Ting Tsai, Cheng-Ying Ho, Tzu-Hsuan Hsu, Shih Pei Chou | 2019-05-07 |
| 10269843 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, Shu-Ting Tsai, Hsiu-Yu Cheng | 2019-04-23 |
| 10157891 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou | 2018-12-18 |
| 10056353 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Chia-Chieh Lin | 2018-08-21 |
| 9917121 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, Shu-Ting Tsai, Hsiu-Yu Cheng | 2018-03-13 |
| 9754925 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou | 2017-09-05 |
| 9748304 | Image sensor devices, methods of manufacture thereof, and semiconductor device manufacturing methods | Shu-Ting Tsai, Szu-Ying Chen, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu | 2017-08-29 |
| 9553020 | Interconnect structure for connecting dies and methods of forming the same | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou, Chia-Chieh Lin | 2017-01-24 |
| 9536920 | Stacked image sensor having a barrier layer | Shu-Ting Tsai, Cheng-Ying Ho, Tzu-Hsuan Hsu, Shih Pei Chou | 2017-01-03 |
| 9412719 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou | 2016-08-09 |
| 9406712 | Interconnect structure for connecting dies and methods of forming the same | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou, Chia-Chieh Lin | 2016-08-02 |
| 9076715 | Interconnect structure for connecting dies and methods of forming the same | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou, Chia-Chieh Lin | 2015-07-07 |
| 9040891 | Image device and methods of forming the same | Dun-Nian Yaung, Jen-Cheng Liu, Yu-Hao Shih, Chih-Chien Wang, Shih Pei Chou +2 more | 2015-05-26 |
| 9041206 | Interconnect structure and method | Shu-Ting Tsai, Dun-Nian Yaung, Cheng-Jong Wang, Jen-Cheng Liu, Feng-Chi Hung +3 more | 2015-05-26 |
| 8952497 | Scribe lines in wafers | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Jeng-Shyan Lin, Shuang-Ji Tsai | 2015-02-10 |