Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165867 | Method for reducing charging of semiconductor wafers | Wei-Lin Chang, Chihy-Yuan Cheng, Sz-Fan Chen, Chien-Hung Lin, Chun-Chang Chen +2 more | 2024-12-10 |
| 11769662 | Method for reducing charging of semiconductor wafers | Wei-Lin Chang, Chihy-Yuan Cheng, Sz-Fan Chen, Chien-Hung Lin, Chun-Chang Chen +2 more | 2023-09-26 |
| 11529245 | Kinematic-axis locating device for knee arthroplasty | — | 2022-12-20 |
| 11086221 | Method of using a surfactant-containing shrinkage material to prevent photoresist pattern collapse caused by capillary forces | Wei-Chao Chiu, Feng-Jia Shiu, Ching-Sen Kuo, Chun-Wei Chang, Kai-Meng Tzeng | 2021-08-10 |
| 10734436 | Method of using a surfactant-containing shrinkage material to prevent photoresist pattern collapse caused by capillary forces | Wei-Chao Chiu, Feng-Jia Shiu, Ching-Sen Kuo, Chun-Wei Chang, Kai-Meng Tzeng | 2020-08-04 |
| 10546889 | Method of high-aspect ratio pattern formation with submicron pixel pitch | Wei-Chao Chiu, Feng-Jia Shiu, Ching-Sen Kuo, Chun-Wei Chang, Kai-Meng Tzeng | 2020-01-28 |
| 10186542 | Patterning for substrate fabrication | Wei-Chao Chiu, Kai-Meng Tzeng, Chun-Wei Chang, Ching-Sen Kuo, Feng-Jia Shiu +1 more | 2019-01-22 |
| 10121811 | Method of high-aspect ratio pattern formation with submicron pixel pitch | Wei-Chao Chiu, Feng-Jia Shiu, Ching-Sen Kuo, Chun-Wei Chang, Kai-Meng Tzeng | 2018-11-06 |
| 10090357 | Method of using a surfactant-containing shrinkage material to prevent photoresist pattern collapse caused by capillary forces | Wei-Chao Chiu, Feng-Jia Shiu, Ching-Sen Kuo, Chun-Wei Chang, Kai-Meng Tzeng | 2018-10-02 |
| 9875892 | Method of forming a photoresist layer | Chun-Wei Chang, Wang-Pen Mo, Hung-Chang Hsieh | 2018-01-23 |
| 9791775 | Lithography process on high topology features | Chun-Wei Chang, Hong-Da Lin, Chun-Chang Chen, Wang-Pen Mo, Hung-Chang Hsieh | 2017-10-17 |
| 9360755 | Thickening phase for spin coating process | Chun-Wei Chang, Chia-Chieh Lin, Wang-Pen Mo, Hung-Chang Hsieh | 2016-06-07 |
| 9285677 | Lithography process on high topology features | Chun-Wei Chang, Hong-Da Lin, Chun-Chang Chen, Wang-Pen Mo, Hung-Chang Hsieh | 2016-03-15 |
| 9153620 | Method of fabricating a metal grid for semiconductor device | Chihy-Yuan Cheng, Chuan-Ling Wu, Chun-Chang Chen, Wang-Pen Mo, Feng-Jia Shiu | 2015-10-06 |
| 9040891 | Image device and methods of forming the same | U-Ting Chen, Dun-Nian Yaung, Jen-Cheng Liu, Yu-Hao Shih, Shih Pei Chou +2 more | 2015-05-26 |
| 9028915 | Method of forming a photoresist layer | Chun-Wei Chang, Wang-Pen Mo, Hung-Chang Hsieh | 2015-05-12 |
| 8940574 | Metal grid in backside illumination image sensor chips and methods for forming the same | Chu-Wei Chang, Wang-Pen Mo, Hung-Chang Hsieh | 2015-01-27 |
| 8770797 | Illumination device having heat dissipating means and light sensor | — | 2014-07-08 |