Issued Patents All Time
Showing 1–25 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735477 | Method of semiconductor integrated circuit fabrication | Ming-Feng Shieh, Wen-Hung Tseng | 2023-08-22 |
| 11378894 | Lithography system with an embedded cleaning module | Shang-Chieh Chien, Jeng-Horng Chen, Jui-Ching Wu, Chia-Chen Chen, Chi-Lun Lu +3 more | 2022-07-05 |
| 11081394 | Method of making a FinFET device | Ming-Feng Shieh, Wen-Hung Tseng, Tzung-Hua Lin | 2021-08-03 |
| 10672656 | Method of semiconductor integrated circuit fabrication | Ming-Feng Shieh, Wen-Hung Tseng | 2020-06-02 |
| 10522413 | Method of forming source/drain contact | Ming-Jhih Kuo, Yu-Hsien Lin, Jhun Hua Chen | 2019-12-31 |
| 10459353 | Lithography system with an embedded cleaning module | Shang-Chieh Chien, Jeng-Horng Chen, Jui-Ching Wu, Chia-Chen Chen, Chi-Lun Lu +3 more | 2019-10-29 |
| 10163720 | Method of forming source/drain contact | Ming-Jhih Kuo, Yu-Hsien Lin, Jhun Hua Chen | 2018-12-25 |
| 10101659 | Lithography method with surface modification layer | Shu-Fang Chen, Hung-Chung Chien, Lin-Hung Shiu | 2018-10-16 |
| 10096519 | Method of making a FinFET device | Ming-Feng Shieh, Wen-Hung Tseng, Tzung-Hua Lin | 2018-10-09 |
| 9996011 | System and method for lithography alignment | Yu-Hsien Lin, Feng-Jia Shiu, Chun-Yi Lee | 2018-06-12 |
| 9929153 | Method of making a FinFET device | Ming-Feng Shieh, Weng-Hung Tseng, Tzung-Hua Lin | 2018-03-27 |
| 9905471 | Integrated circuit structure and method forming trenches with different depths | Yuan-Yen Lo, Jhih-Yu Wang, Jhun Hua Chen | 2018-02-27 |
| 9875892 | Method of forming a photoresist layer | Chun-Wei Chang, Chih-Chien Wang, Wang-Pen Mo | 2018-01-23 |
| 9823574 | Lithography alignment marks | Ching-Huang Chen, Kuei-Liang Lu, Ya Hui Chang, Spencer B. T. Lin | 2017-11-21 |
| 9805154 | Method of lithography process with inserting scattering bars | Irene Ho, Ai-Jen Hung, Kuei-Liang Lu, Ya Hui Chang | 2017-10-31 |
| 9799567 | Method of forming source/drain contact | Ming-Jhih Kuo, Yu-Hsien Lin, Jhun Hua Chen | 2017-10-24 |
| 9791775 | Lithography process on high topology features | Chun-Wei Chang, Hong-Da Lin, Chih-Chien Wang, Chun-Chang Chen, Wang-Pen Mo | 2017-10-17 |
| 9711367 | Semiconductor method with wafer edge modification | Hung-Chung Chien, Jhun Hua Chen, Shu-Fang Chen | 2017-07-18 |
| 9703918 | Two-dimensional process window improvement | Wei-De Ho, Chi-Yuan Sun, Ya Hui Chang | 2017-07-11 |
| 9651869 | Film portion at wafer edge | Chun-Wei Chang, Wang-Pen Mo | 2017-05-16 |
| 9466486 | Method for integrated circuit patterning | Ming-Feng Shieh, Ru-Gun Liu, Tien-I Bao, Chung-Ju Lee, Shau-Lin Shue | 2016-10-11 |
| 9443768 | Method of making a FinFET device | Ming-Feng Shieh, Han-Wei Wu | 2016-09-13 |
| 9437497 | Method of making a FinFET device | Ming-Feng Shieh, Weng-Hung Tseng, Tzung-Hua Lin | 2016-09-06 |
| 9372406 | Film portion at wafer edge | Chun-Wei Chang, Wang-Pen Mo | 2016-06-21 |
| 9360755 | Thickening phase for spin coating process | Chun-Wei Chang, Chia-Chieh Lin, Chih-Chien Wang, Wang-Pen Mo | 2016-06-07 |