Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412867 | Integrated fan-out package and manufacturing method thereof | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu | 2025-09-09 |
| 12211802 | Package structure and method of fabricating the same | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu | 2025-01-28 |
| 12205903 | Semiconductor package and manufacturing method thereof | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu | 2025-01-21 |
| 11894336 | Integrated fan-out package and manufacturing method thereof | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu | 2024-02-06 |
| 11854997 | Method of forming semiconductor device | Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-12-26 |
| 11798893 | Semiconductor package and manufacturing method thereof | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu | 2023-10-24 |
| 11694967 | Package structure and method of fabricating the same | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu | 2023-07-04 |
| 11289426 | Semiconductor package and manufacturing method thereof | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu | 2022-03-29 |
| 11276647 | Method of forming semiconductor device | Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2022-03-15 |
| 11114407 | Integrated fan-out package and manufacturing method thereof | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu | 2021-09-07 |
| 10978405 | Integrated fan-out package | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2021-04-13 |
| 10607941 | Method of forming semiconductor device | Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2020-03-31 |
| 9905471 | Integrated circuit structure and method forming trenches with different depths | Yuan-Yen Lo, Jhun Hua Chen, Hung-Chang Hsieh | 2018-02-27 |
| 9383657 | Method and structure for lithography processes with focus monitoring and control | Chien-Yu Li, Iu-Ren Chen, Chi-Cheng Hung, Wei-Liang Lin, Chun-Kuang Chen | 2016-07-05 |