Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412867 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2025-09-09 |
| 12315772 | Package and manufacturing method thereof | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2025-05-27 |
| 12283545 | Package structure and method of manufacturing the same | Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen | 2025-04-22 |
| 12211815 | Micro LED display panel | Shiang-Ning Yang, Yu-Yun Lo, Bo-Wei Wu, Yu-Ya Peng | 2025-01-28 |
| 12211802 | Package structure and method of fabricating the same | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2025-01-28 |
| 12205903 | Semiconductor package and manufacturing method thereof | Hung-Jui Kuo, Jhih-Yu Wang, Yu-Hsiang Hu | 2025-01-21 |
| 12142601 | Micro light-emitting diode package structure and micro light-emitting diode display apparatus | Yen-Yeh Chen | 2024-11-12 |
| 12087654 | Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Tian Hu | 2024-09-10 |
| 11942417 | Sensor package and method | Sih-Hao Liao, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2024-03-26 |
| 11894336 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2024-02-06 |
| 11869418 | Micro light emitting diode display panel | Shiang-Ning Yang, Chang-Rong Lin, Yu-Ya Peng | 2024-01-09 |
| 11862614 | Micro LED display device and manufacturing method thereof | Yu-Hung Lai, Pei-Hsin Chen, Yi-Ching Chen, Yi-Chun Shih | 2024-01-02 |
| 11862560 | Package structure and method of manufacturing the same | Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen | 2024-01-02 |
| 11854997 | Method of forming semiconductor device | Jhih-Yu Wang, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-12-26 |
| 11798893 | Semiconductor package and manufacturing method thereof | Hung-Jui Kuo, Jhih-Yu Wang, Yu-Hsiang Hu | 2023-10-24 |
| 11798857 | Composition for sacrificial film, package, manufacturing method of package | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2023-10-24 |
| 11764124 | Sensing component encapsulated by an encapsulant with a roughness surface having a hollow region | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Tian Hu | 2023-09-19 |
| 11694967 | Package structure and method of fabricating the same | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2023-07-04 |
| 11289426 | Semiconductor package and manufacturing method thereof | Hung-Jui Kuo, Jhih-Yu Wang, Yu-Hsiang Hu | 2022-03-29 |
| 11289396 | Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Tian Hu | 2022-03-29 |
| 11276647 | Method of forming semiconductor device | Jhih-Yu Wang, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2022-03-15 |
| 11164814 | Package structure and method of manufacturing the same | Hung-Jui Kuo, Yu-Hsiang Hu, Wei-Chih Chen | 2021-11-02 |
| 11164839 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Po-Han Wang +1 more | 2021-11-02 |
| 11114407 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2021-09-07 |
| 10607941 | Method of forming semiconductor device | Jhih-Yu Wang, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2020-03-31 |