Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12171200 | Carbon sink enhancement method based on oyster-undaria pinnatifida integrated aquaculture | Jie Su, Jingfeng Fan, Hongxia Ming, Kuishuang Shao, Tingting Shi | 2024-12-24 |
| 12087654 | Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2024-09-10 |
| 12068273 | Package | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2024-08-20 |
| 11764124 | Sensing component encapsulated by an encapsulant with a roughness surface having a hollow region | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2023-09-19 |
| 11600592 | Package | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2023-03-07 |
| 11289396 | Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2022-03-29 |
| 11171098 | Package and manufacturing method thereof | Hung-Jui Kuo, Yu-Hsiang Hu | 2021-11-09 |
| 11121299 | Semiconductor device and method | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2021-09-14 |