Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396283 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2025-08-19 |
| 11978758 | Methods and apparatus for via last through-vias | Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu | 2024-05-07 |
| 11646247 | Ion through-substrate via | Yu-Yang Shen, Chien-Hsien Tseng, Dun-Nian Yaung, Nai-Wen Cheng | 2023-05-09 |
| 11600653 | Methods and apparatus for via last through-vias | Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu | 2023-03-07 |
| 11552027 | Semiconductor packaging device comprising a shield structure | Wei-Yu Chien, Chien-Hsien Tseng, Dun-Nian Yaung, Nai-Wen Cheng, Yi-Shin Chu +1 more | 2023-01-10 |
| 11545443 | Method for forming hybrid-bonding structure | Kuo-Ming Wu, Kuan-Liang Liu | 2023-01-03 |
| 11532661 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2022-12-20 |
| 11037885 | Semiconductor packaging device comprising a shield structure | Wei-Yu Chien, Chien-Hsien Tseng, Dun-Nian Yaung, Nai-Wen Cheng, Yi-Shin Chu +1 more | 2021-06-15 |
| 10930699 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Meng-Hsun Wan, Dun-Nian Yaung, Jen-Cheng Liu | 2021-02-23 |
| 10867891 | Ion through-substrate via | Yu-Yang Shen, Chien-Hsien Tseng, Dun-Nian Yaung, Nai-Wen Cheng | 2020-12-15 |
| 10790240 | Metal line design for hybrid-bonding application | Kuo-Ming Wu, Kuan-Liang Liu | 2020-09-29 |
| 10777539 | Seal-ring structure for stacking integrated circuits | Yi-Shin Chu, Kuan-Chieh Huang, Shuang-Ji Tsai, Yi-Hao Chen, Feng-Kuei Chang | 2020-09-15 |
| 10510792 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2019-12-17 |
| 10510791 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Jen-Cheng Liu, Dun-Nian Yaung | 2019-12-17 |
| 10475772 | Seal-ring structure for stacking integrated circuits | Yi-Shin Chu, Kuan-Chieh Huang, Shuang-Ji Tsai, Yi-Hao Chen, Feng-Kuei Chang | 2019-11-12 |
| 10475843 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Meng-Hsun Wan, Dun-Nian Yaung, Jen-Cheng Liu | 2019-11-12 |
| 10269863 | Methods and apparatus for via last through-vias | Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu | 2019-04-23 |
| 10157895 | Seal-ring structure for stacking integrated circuits | Yi-Shin Chu, Kuan-Chieh Huang, Shuang-Ji Tsai, Yi-Hao Chen, Feng-Kuei Chang | 2018-12-18 |
| 10134794 | Image sensor chip sidewall interconnection | Kuo-Chin Huang, Wei-Chieh Chiang, Kazuaki Hashimoto, Jen-Cheng Liu | 2018-11-20 |
| 10062721 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Jen-Cheng Liu, Dun-Nian Yaung | 2018-08-28 |
| 9972603 | Seal-ring structure for stacking integrated circuits | Yi-Shin Chu, Kuan-Chieh Huang, Shuang-Ji Tsai, Yi-Hao Chen, Feng-Kuei Chang | 2018-05-15 |
| 9929198 | Infrared image sensor | Keng-Yu Chou, Kazuaki Hashimoto, Jen-Cheng Liu, Jhy-Jyi Sze, Wei-Chieh Chiang | 2018-03-27 |
| 9859322 | Methods and apparatus for glass removal in CMOS image sensors | Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu | 2018-01-02 |
| 9806119 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2017-10-31 |
| 9780134 | Semiconductor device and method of forming the same | Kazuaki Hashimoto, Jen-Cheng Liu, Wei-Chieh Chiang | 2017-10-03 |