Issued Patents All Time
Showing 1–25 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255062 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh +2 more | 2025-03-18 |
| 11854795 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh +2 more | 2023-12-26 |
| 11735635 | Semiconductor device and fabrication method thereof | Chun-Han Tsao, Chih-Ming Chen, Han-Yu Chen, Szu-Yu Wang, Cheng-Yuan Tsai | 2023-08-22 |
| 11508562 | Low contamination chamber for surface activation | Ping-Yin Liu, Xin-Hua Huang, Lee-Chuan Tseng | 2022-11-22 |
| 11282697 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh +2 more | 2022-03-22 |
| 11069785 | Semiconductor device and fabrication method thereof | Chun-Han Tsao, Chih-Ming Chen, Han-Yu Chen, Szu-Yu Wang, Cheng-Yuan Tsai | 2021-07-20 |
| 11014805 | Method of forming semiconductor package and semiconductor package | Chun-Wen Cheng, Hung-Chia Tsai, Yuan-Chih Hsieh, Ping-Yin Liu | 2021-05-25 |
| 10790189 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Yeur-Luen Tu +2 more | 2020-09-29 |
| 10665449 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh +2 more | 2020-05-26 |
| 10384933 | Method of forming micro electromechanical system sensor | Chun-Wen Cheng, Hung-Chia Tsai, Yuan-Chih Hsieh, Ping-Yin Liu | 2019-08-20 |
| 10354972 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Xin-Hua Huang, Chia-Shiung Tsai | 2019-07-16 |
| 10283448 | Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same | Ping-Yin Liu, Kai-Wen Cheng, Xin-Hua Huang, Chia-Shiung Tsai, Xiaomeng Chen | 2019-05-07 |
| 10276678 | Semiconductor device and fabrication method thereof | Chun-Han Tsao, Chih-Ming Chen, Han-Yu Chen, Szu-Yu Wang, Cheng-Yuan Tsai | 2019-04-30 |
| 10160638 | Method and apparatus for a semiconductor structure | Li-Cheng Chu, Ping-Yin Liu, Xin-Hua Huang, Yuan-Chih Hsieh, Chun-Wen Cheng | 2018-12-25 |
| 10128209 | Wafer bonding process and structure | Ping-Yin Liu, Cheng-Tai Hsiao, Xin-Hua Huang, Hsun-Chung Kuang | 2018-11-13 |
| 10119909 | Biological sensing structures | Hung-Hua Lin, Li-Cheng Chu, Ming-Tung Wu, Yuan-Chih Hsieh, Chia-Shiung Tsai | 2018-11-06 |
| 10103122 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Xin-Hua Huang, Chia-Shiung Tsai | 2018-10-16 |
| 10096645 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu +1 more | 2018-10-09 |
| 10090196 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Yeur-Luen Tu +2 more | 2018-10-02 |
| 10049901 | Apparatus and method for wafer level bonding | Ping-Yin Liu, Yen-Chang Chu, Xin-Hua Huang, Yeur-Luen Tu, Ru-Liang Lee | 2018-08-14 |
| 10037968 | Alignment systems and wafer bonding systems and methods | Xin-Hua Huang, Xiaomeng Chen, Ping-Yin Liu | 2018-07-31 |
| 9960129 | Hybrid bonding mechanisms for semiconductor wafers | Ping-Yin Liu, Szu-Ying Chen, Chen-Jong Wang, Chih-Hui Huang, Xin-Hua Huang +3 more | 2018-05-01 |
| 9953847 | Apparatus and method for cleaning | Ping-Yin Liu, Xin-Hua Huang | 2018-04-24 |
| 9887155 | Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same | Ping-Yin Liu, Kai-Wen Cheng, Xin-Hua Huang, Chia-Shiung Tsai, Xiaomeng Chen | 2018-02-06 |
| 9842785 | Apparatus and method for verification of bonding alignment | Xin-Hua Huang, Ping-Yin Liu | 2017-12-12 |