Issued Patents All Time
Showing 26–50 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786628 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2017-10-10 |
| 9754827 | Semiconductor device and fabrication method thereof | Chun-Han Tsao, Chih-Ming Chen, Han-Yu Chen, Szu-Yu Wang, Cheng-Yuan Tsai | 2017-09-05 |
| 9748198 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Xin-Hua Huang, Chia-Shiung Tsai | 2017-08-29 |
| 9741681 | Debonding schemes | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Chia-Shiung Tsai | 2017-08-22 |
| 9735033 | Multiple swivel arm design in hybrid bonder | Xin-Hua Huang, Ping-Yin Liu | 2017-08-15 |
| 9725310 | Micro electromechanical system sensor and method of forming the same | Chun-Wen Cheng, Hung-Chia Tsai, Yuan-Chih Hsieh, Ping-Yin Liu | 2017-08-08 |
| 9708179 | Method of improving getter efficiency by increasing superficial area | Yuan-Chih Hsieh, Li-Cheng Chu, Hung-Hua Lin, Chih-Jen Chan | 2017-07-18 |
| 9646860 | Alignment systems and wafer bonding systems and methods | Xin-Hua Huang, Xiaomeng Chen, Ping-Yin Liu | 2017-05-09 |
| 9611141 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh +3 more | 2017-04-04 |
| 9576827 | Apparatus and method for wafer level bonding | Ping-Yin Liu, Yen-Chang Chu, Xin-Hua Huang, Yeur-Luen Tu, Ru-Liang Lee | 2017-02-21 |
| 9533876 | MEMS structures and methods for forming the same | Ping-Yin Liu, Xin-Hua Huang, Hsin-Ting Huang, Yuan-Chih Hsieh, Jung-Huei Peng +2 more | 2017-01-03 |
| 9527188 | Grinding wheel for wafer edge trimming | Xin-Hua Huang, Ping-Yin Liu, Yuan-Chih Hsieh, Chia-Shiung Tsai | 2016-12-27 |
| 9508586 | Debonding schemes | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Chia-Shiung Tsai | 2016-11-29 |
| 9502396 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2016-11-22 |
| 9478471 | Apparatus and method for verification of bonding alignment | Xin-Hua Huang, Ping-Yin Liu | 2016-10-25 |
| 9472504 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Li-Cheng Chu, Ming-Tung Wu, Ping-Yin Liu, Chia-Shiung Tsai | 2016-10-18 |
| 9446467 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Xin-Chung Kuang, Yuan-Chih Hsieh +2 more | 2016-09-20 |
| 9443796 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2016-09-13 |
| 9425155 | Wafer bonding process and structure | Ping-Yin Liu, Hsun-Chung Kuang, Cheng-Tai Hsiao, Xin-Hua Huang | 2016-08-23 |
| 9412725 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu +1 more | 2016-08-09 |
| 9406711 | Apparatus and method for backside illuminated image sensors | Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung, Ping-Yin Liu | 2016-08-02 |
| 9385010 | Multiple swivel arm design in hybrid bonder | Xin-Hua Huang, Ping-Yin Liu | 2016-07-05 |
| 9377401 | Biological sensing structures | Hung-Hua Lin, Li-Cheng Chu, Ming-Tung Wu, Yuan-Chih Hsieh, Chia-Shiung Tsai | 2016-06-28 |
| 9355882 | Transfer module for bowed wafers | Ming-Tung Wu, Yuan-Chih Hsieh, Chia-Shiung Tsai | 2016-05-31 |
| 9337168 | Hermetic wafer level packaging | Richard Chu, Martin Liu, Chia-Hua Chu, Yuan-Chih Hsieh, Chung-Hsien Lin +2 more | 2016-05-10 |