Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183571 | Integrated aligned stealth laser for wafer edge trimming process | Hsun-Chung Kuang, Tung-He Chou | 2024-12-31 |
| 11901171 | Integrated aligned stealth laser with blade and grinding apparatus for wafer edge trimming process | Hsun-Chung Kuang, Tung-He Chou | 2024-02-13 |
| 11605534 | Particle prevention in wafer edge trimming | Tung-He Chou, Sheng-Chau Chen, Hsun-Chung Kuang | 2023-03-14 |
| 11342199 | Wafer carrier assembly | Hsun-Chung Kuang | 2022-05-24 |
| 11081334 | Particle prevention in wafer edge trimming | Tung-He Chou, Sheng-Chau Chen, Hsun-Chung Kuang | 2021-08-03 |
| 10879077 | Planarization apparatus and planarization method thereof | Chun-Kai Lan, Tung-He Chou, Hsun-Chung Kuang | 2020-12-29 |
| 10857651 | Apparatus of chemical mechanical polishing and operating method thereof | Chun-Kai Lan, Tung-He Chou, Sheng-Chau Chen, Hsun-Chung Kuang | 2020-12-08 |
| 10510563 | Wafer carrier assembly | Hsun-Chung Kuang | 2019-12-17 |
| 10119909 | Biological sensing structures | Hung-Hua Lin, Li-Cheng Chu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2018-11-06 |
| 9472504 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Li-Cheng Chu, Ping-Yin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2016-10-18 |
| 9377401 | Biological sensing structures | Hung-Hua Lin, Li-Cheng Chu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2016-06-28 |
| 9355882 | Transfer module for bowed wafers | Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2016-05-31 |
| 9099476 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Li-Cheng Chu, Ping-Yin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2015-08-04 |
| 9034677 | MEMS device and method of formation thereof | Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Yao-Te Huang, Ping-Yin Liu +2 more | 2015-05-19 |
| 8846129 | Biological sensing structures and methods of forming the same | Hung-Hua Lin, Li-Cheng Chu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2014-09-30 |
| 8735260 | Method to prevent metal pad damage in wafer level package | Shang-Ying Tsai, Jung-Huei Peng, Hsin-Ting Huang, Hung-Hua Lin, Ping-Yin Liu +2 more | 2014-05-27 |
| 8598687 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Richard Chu, Martin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2013-12-03 |
| 8580594 | Method of fabricating a semiconductor device having recessed bonding site | Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Yao-Te Huang, Ping-Yin Liu +2 more | 2013-11-12 |
| 8445380 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Richard Chu, Martin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2013-05-21 |
| 8207595 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Richard Chu, Martin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2012-06-26 |