Issued Patents All Time
Showing 1–25 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412863 | Die attached leveling control by metal stopper bumps | Wei-Jhih Mao, Kuei-Sung Chang | 2025-09-09 |
| 12358783 | Wire-bond damper for shock absorption | Tsung-Lin Hsieh, Wei-Jhih Mao, Kuei-Sung Chang, Chun-Wen Cheng | 2025-07-15 |
| 12322722 | Die attached leveling control by metal stopper bumps | Wei-Jhih Mao, Kuei-Sung Chang | 2025-06-03 |
| 12303888 | Method to produce chemical pattern in micro-fluidic structure | Li-Min Hung, Jung-Huei Peng, Shane Bowen, Hui Han, Danny Yuan Chan +1 more | 2025-05-20 |
| 12191185 | Vacuum wafer chuck for manufacturing semiconductor devices | Chien-Fa Lee, Chin-Lin CHOU, Shou-Wen Kuo, Kuei-Sung Chang, Jiun-Rong Pai +2 more | 2025-01-07 |
| 11993510 | Composite spring structure to reinforce mechanical robustness of a MEMS device | Kuei-Sung Chang, Wei-Jhih Mao | 2024-05-28 |
| 11987494 | Wire-bond damper for shock absorption | Tsung-Lin Hsieh, Wei-Jhih Mao, Kuei-Sung Chang, Chun-Wen Cheng | 2024-05-21 |
| 11923331 | Die attached leveling control by metal stopper bumps | Wei-Jhih Mao, Kuei-Sung Chang | 2024-03-05 |
| 11765975 | Thermocouple device | Ming-Hsien Tsai, Fu-Lung Hsueh, Shih-Ming Yang, Jheng-Yuan Wang, Ming-De Chen | 2023-09-19 |
| 11713242 | MEMS device with dummy-area utilization for pressure enhancement | Chun-Wen Cheng, Fei-Lung Lai, Kuei-Sung Chang | 2023-08-01 |
| 11661333 | Semiconductor structure and manufacturing method thereof | Wei-Jhih Mao, Kuei-Sung Chang, Chun-Wen Cheng | 2023-05-30 |
| 11591211 | Semiconductive structure and manufacturing method thereof | Yen-Cheng Liu, Cheng-Yu Hsieh, Kuei-Sung Chang | 2023-02-28 |
| 11542151 | MEMS apparatus with anti-stiction layer | Kuei-Sung Chang, Fei-Lung Lai, Cheng-Yu Hsieh | 2023-01-03 |
| 11530130 | Method of making ohmic contact on low doped bulk silicon for optical alignment | Kuei-Sung Chang, Chia-Hua Chu | 2022-12-20 |
| 11508608 | Vacuum wafer chuck for manufacturing semiconductor devices | Chien-Fa Lee, Chin-Lin CHOU, Shou-Wen Kuo, Kuei-Sung Chang, Jiun-Rong Pai +2 more | 2022-11-22 |
| 11485631 | Method of making ohmic contact on low doped bulk silicon for optical alignment | Kuei-Sung Chang, Chia-Hua Chu | 2022-11-01 |
| 11420866 | Composite spring structure to reinforce mechanical robustness of a MEMS device | Kuei-Sung Chang, Wei-Jhih Mao | 2022-08-23 |
| 11298697 | Method to produce chemical pattern in micro-fluidic structure | Li-Min Hung, Jung-Huei Peng, Shane Bowen, Hui Han, Danny Yuan Chan +1 more | 2022-04-12 |
| 11251354 | Thermocouple device | Ming-Hsien Tsai, Fu-Lung Hsueh, Shih-Ming Yang, Jheng-Yuan Wang, Ming-De Chen | 2022-02-15 |
| 11174158 | MEMS device with dummy-area utilization for pressure enhancement | Chun-Wen Cheng, Fei-Lung Lai, Kuei-Sung Chang | 2021-11-16 |
| 11130670 | MEMS devices with an element having varying widths | Hung-Hua Lin, Hsin-Ting Huang, Lung Yuan Pan, Jung-Huei Peng, Yao-Te Huang | 2021-09-28 |
| 11117796 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Jung-Huei Peng, Hung-Chia Tsai, Yi-Chuan Teng | 2021-09-14 |
| 11104129 | MEMS devices and methods of fabrication thereof | Jung-Huei Peng, Chun-Ren Cheng, Jiou-Kang Lee, Ting-Hau Wu | 2021-08-31 |
| 11027310 | Fluid deposition apparatus and method | Chun-Wen Cheng, Jung-Huei Peng, Yi-Shao Liu, Fei-Lung Lai | 2021-06-08 |
| 10867836 | Wafer stack and fabrication method thereof | Kuei-Sung Chang, Ching-Ray Chen, Yen-Cheng Liu | 2020-12-15 |