Issued Patents All Time
Showing 51–75 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9469524 | Semiconductor device with through molding vias and method of making the same | Chun-Wen Cheng, Jung-Huei Peng, Hung-Chia Tsai, Yi-Chuan Teng | 2016-10-18 |
| 9355896 | Package systems | Chia-Pao Shu, Chun-Wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Jung-Huei Peng | 2016-05-31 |
| 9352956 | MEMS devices and methods for forming same | Chun-Wen Cheng, Jung-Huei Peng, Hung-Chia Tsai, Yi-Chuan Teng | 2016-05-31 |
| 9352315 | Method to produce chemical pattern in micro-fluidic structure | Li-Min Hung, Jung-Huei Peng | 2016-05-31 |
| 9269679 | Wafer level packaging techniques | Yi-Chuan Teng, Jung-Huei Peng, Li-Min Hung, Yao-Te Huang, Chin-Yi Cho | 2016-02-23 |
| 9246401 | Energy-harvesting device and method of forming the same | Tien-Kan Chung, Wen-Chuan Tai, Yao-Te Huang, Hsin-Ting Huang, Chang-Yi Yang +1 more | 2016-01-26 |
| 9238581 | Triple-axis MEMS accelerometer | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng | 2016-01-19 |
| 9181083 | MEMS devices and methods of forming the same | Hung-Hua Lin, Lung Yuan Pan, Yao-Te Huang, Hsin-Ting Huang, Jung-Huei Peng | 2015-11-10 |
| 9150404 | Semiconductor device with through molding vias | Chun-Wen Cheng, Jung-Huei Peng, Hung-Chia Tsai, Yi-Chuan Teng | 2015-10-06 |
| 9138994 | MEMS devices and methods of fabrication thereof | Jung-Huei Peng, Chun-Ren Cheng, Jiou-Kang Lee, Ting-Hau Wu | 2015-09-22 |
| 9114396 | Method of making flowcell with micro-fluid structure | Jung-Huei Peng, Li-Ming Hung | 2015-08-25 |
| 9112001 | Package systems and manufacturing methods thereof | Chia-Pao Shu, Chun-Wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Jung-Huei Peng | 2015-08-18 |
| 9034677 | MEMS device and method of formation thereof | Hsin-Ting Huang, Jung-Huei Peng, Yao-Te Huang, Ming-Tung Wu, Ping-Yin Liu +2 more | 2015-05-19 |
| 8941152 | Semiconductor device | Chun-Wen Cheng, Jung-Huei Peng, Hung-Chia Tsai, Yi-Chuan Teng | 2015-01-27 |
| 8928162 | Sensor with energy-harvesting device | Tien-Kan Chung, Wen-Chuan Tai, Yao-Te Huang, Hsin-Ting Huang, Chang-Yi Yang +1 more | 2015-01-06 |
| 8905293 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Li-Cheng Chu, Hung-Hua Lin, Yuan-Chih Hsieh, Jung-Huei Peng +3 more | 2014-12-09 |
| 8853801 | MEMS devices and methods of forming the same | Jung-Huei Peng, Hsin-Ting Huang, Yao-Te Huang, Lung Yuan Pan, Hung-Hua Lin | 2014-10-07 |
| 8841201 | Systems and methods for post-bonding wafer edge seal | Yi-Chuan Teng, Jung-Huei Peng, Hsin-Ting Huang, Lin-Min Hung, Yao-Te Huang +1 more | 2014-09-23 |
| 8776600 | Gyroscope sensors | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng | 2014-07-15 |
| 8735260 | Method to prevent metal pad damage in wafer level package | Jung-Huei Peng, Hsin-Ting Huang, Hung-Hua Lin, Ming-Tung Wu, Ping-Yin Liu +2 more | 2014-05-27 |
| 8723343 | Sensor with energy-harvesting device | Tien-Kan Chung, Wen-Chuan Tai, Yao-Te Huang, Hsin-Ting Huang, Chang-Yi Yang +1 more | 2014-05-13 |
| 8686571 | Bonding layer structure and method for wafer to wafer bonding | Hsin-Ting Huang, Jung-Huei Peng, Li-Min Hung, Yao-Te Huang, Yi-Chuan Teng +1 more | 2014-04-01 |
| 8674495 | Package systems having a eutectic bonding material and manufacturing methods thereof | Chia-Pao Shu, Chun-Wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Jung-Huei Peng | 2014-03-18 |
| 8580594 | Method of fabricating a semiconductor device having recessed bonding site | Hsin-Ting Huang, Jung-Huei Peng, Yao-Te Huang, Ming-Tung Wu, Ping-Yin Liu +2 more | 2013-11-12 |
| 8563400 | Laser bonding for stacking semiconductor substrates | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng | 2013-10-22 |