Issued Patents All Time
Showing 76–90 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8455999 | Method for reducing chip warpage | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng | 2013-06-04 |
| 8377798 | Method and structure for wafer to wafer bonding in semiconductor packaging | Jung-Huei Peng, Hsin-Ting Huang, Yao-Te Huang, Ping-Yin Liu | 2013-02-19 |
| 8367516 | Laser bonding for stacking semiconductor substrates | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng | 2013-02-05 |
| 8362578 | Triple-axis MEMS accelerometer | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng | 2013-01-29 |
| 8309441 | Process for eliminating delamination between amorphous silicon layers | Jiou-Kang Lee, Chun-Ren Cheng, Ting-Hau Wu, Hsiang-Fu Chen | 2012-11-13 |
| 8281658 | Method to produce 3-D optical gyroscope my MEMS technology | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng | 2012-10-09 |
| 8237263 | Method and apparatus for cooling an integrated circuit | Ting-Hau Wu, Chun-Ren Cheng, Chun-Wen Cheng, Jiou-Kang Lee, Jung-Huei Peng +1 more | 2012-08-07 |
| 8237235 | Metal-ceramic multilayer structure | Ting-Hau Wu, Chun-Ren Cheng, Jung-Huei Peng, Jiou-Kang Lee | 2012-08-07 |
| 8218286 | MEMS microphone with single polysilicon film | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng | 2012-07-10 |
| 8106470 | Triple-axis MEMS accelerometer having a bottom capacitor | Ting-Hau Wu, Chun-Wen Cheng, Chun-Ren Cheng, Jung-Huei Peng, Jiou-Kang Lee +1 more | 2012-01-31 |
| 8053377 | Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same | Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng, Ting-Hau Wu | 2011-11-08 |
| 8053336 | Method for reducing chip warpage | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Jung-Huei Peng | 2011-11-08 |
| 7999257 | Process for eliminating delamination between amorphous silicon layers | Jiou-Kang Lee, Chun-Ren Cheng, Ting-Hau Wu, Hsiang-Fu Chen | 2011-08-16 |
| 7998775 | Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures | Chun-Ren Cheng, Jung-Huei Peng, Jiou-Kang Lee, Ting-Hau Wu | 2011-08-16 |
| 7923379 | Multi-step process for forming high-aspect-ratio holes for MEMS devices | Jiou-Kang Lee, Ting-Hau Wu, Jung-Huei Peng, Chun-Ren Cheng | 2011-04-12 |