Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11820967 | Hanging drop device, formation method of hanging drop and cell culture method by using hanging drop | Jen-Huang Huang, Tzu-Hsiang Chiang | 2023-11-21 |
| 11678133 | Structure for integrated microphone | Jung-Huei Peng, Chia-Hua Chu, Chun-Wen Cheng, Li-Min Hung, Yao-Te Huang | 2023-06-13 |
| 10779100 | Method for manufacturing a microphone | Jung-Huei Peng, Chia-Hua Chu, Chun-Wen Cheng, Li-Min Hung, Yao-Te Huang | 2020-09-15 |
| 9998843 | Method for manufacturing a microphone | Jung-Huei Peng, Chia-Hua Chu, Chun-Wen Cheng, Li-Min Hung, Yao-Te Huang | 2018-06-12 |
| 9673169 | Method and apparatus for a wafer seal ring | Yi-Chuan Teng, Jung-Huei Peng, Shang-Ying Tsai, Hsin-Ting Huang, Li-Min Hung +1 more | 2017-06-06 |
| 9545691 | Method of removing waste of substrate and waste removing device thereof | Yi-Chuan Teng, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang, Jung-Huei Peng | 2017-01-17 |
| 9462402 | Monolithic complementary metal-oxide semiconductor (CMOS)-integrated silicon microphone | Chia-Hua Chu, Chun-Wen Cheng, Jung-Huei Peng, Yao-Te Huang | 2016-10-04 |
| 9269679 | Wafer level packaging techniques | Yi-Chuan Teng, Jung-Huei Peng, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang | 2016-02-23 |
| 9264833 | Structure and method for integrated microphone | Jung-Huei Peng, Chia-Hua Chu, Yao-Te Huang, Li-Min Hung, Chun-Wen Cheng | 2016-02-16 |
| 8841201 | Systems and methods for post-bonding wafer edge seal | Yi-Chuan Teng, Jung-Huei Peng, Shang-Ying Tsai, Hsin-Ting Huang, Lin-Min Hung +1 more | 2014-09-23 |
| 8686571 | Bonding layer structure and method for wafer to wafer bonding | Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang +1 more | 2014-04-01 |