Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12303888 | Method to produce chemical pattern in micro-fluidic structure | Shang-Ying Tsai, Jung-Huei Peng, Shane Bowen, Hui Han, Danny Yuan Chan +1 more | 2025-05-20 |
| 11678133 | Structure for integrated microphone | Jung-Huei Peng, Chia-Hua Chu, Chun-Wen Cheng, Chin-Yi Cho, Yao-Te Huang | 2023-06-13 |
| 11298697 | Method to produce chemical pattern in micro-fluidic structure | Shang-Ying Tsai, Jung-Huei Peng, Shane Bowen, Hui Han, Danny Yuan Chan +1 more | 2022-04-12 |
| 10779100 | Method for manufacturing a microphone | Jung-Huei Peng, Chia-Hua Chu, Chun-Wen Cheng, Chin-Yi Cho, Yao-Te Huang | 2020-09-15 |
| 10486153 | Method to produce chemical pattern in micro-fluidic structure | Shang-Ying Tsai, Jung-Huei Peng | 2019-11-26 |
| 10273148 | Micro-electro-mechanical system and manufacturing method thereof | Chun-Wen Cheng, Jung-Huei Peng, Chia-Hua Chu, Nien-Tsung Tsai, Yao-Te Huang +1 more | 2019-04-30 |
| 9998843 | Method for manufacturing a microphone | Jung-Huei Peng, Chia-Hua Chu, Chun-Wen Cheng, Chin-Yi Cho, Yao-Te Huang | 2018-06-12 |
| 9673169 | Method and apparatus for a wafer seal ring | Yi-Chuan Teng, Jung-Huei Peng, Shang-Ying Tsai, Hsin-Ting Huang, Yao-Te Huang +1 more | 2017-06-06 |
| 9656260 | Method to produce chemical pattern in micro-fluidic structure | Shang-Ying Tsai, Jung-Huei Peng | 2017-05-23 |
| 9643838 | Semiconductor device and package and manufacturing method thereof | Chia-Hua Chu, Jung-Huei Peng, Yi-Chien Wu | 2017-05-09 |
| 9545691 | Method of removing waste of substrate and waste removing device thereof | Chin-Yi Cho, Yi-Chuan Teng, Shang-Ying Tsai, Yao-Te Huang, Jung-Huei Peng | 2017-01-17 |
| 9352315 | Method to produce chemical pattern in micro-fluidic structure | Shang-Ying Tsai, Jung-Huei Peng | 2016-05-31 |
| 9269679 | Wafer level packaging techniques | Yi-Chuan Teng, Jung-Huei Peng, Shang-Ying Tsai, Yao-Te Huang, Chin-Yi Cho | 2016-02-23 |
| 9264833 | Structure and method for integrated microphone | Jung-Huei Peng, Chia-Hua Chu, Yao-Te Huang, Chin-Yi Cho, Chun-Wen Cheng | 2016-02-16 |
| 8686571 | Bonding layer structure and method for wafer to wafer bonding | Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Yao-Te Huang, Yi-Chuan Teng +1 more | 2014-04-01 |