Issued Patents All Time
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255062 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2025-03-18 |
| 12234141 | Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same | Kuei-Sung Chang, Tai-Bang An, Chun-Wen Cheng | 2025-02-25 |
| 12185631 | Pizoelectric MEMS device with electrodes having low surface roughness | Yi-Ren Wang, Yuan-Chih Hsieh | 2024-12-31 |
| 12139399 | Conductive bond structure to increase membrane sensitivity in MEMS device | Chia-Ming Hung, Xin-Hua Huang, Yuan-Chih Hsieh | 2024-11-12 |
| 12134824 | Undercut-free patterned aluminum nitride structure and methods for forming the same | Yuan-Chih Hsieh, Yi-Ren Wang | 2024-11-05 |
| 11932534 | MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion | Chang-Ming Wu, Chung-Yi Yu, Ping-Yin Liu, Jung-Huei Peng | 2024-03-19 |
| 11854795 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2023-12-26 |
| 11827513 | Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same | Kuei-Sung Chang, Tai-Bang An, Chun-Wen Cheng | 2023-11-28 |
| 11812664 | Pizoelectric MEMS device with electrodes having low surface roughness | Yi-Ren Wang, Yuan-Chih Hsieh | 2023-11-07 |
| 11634318 | MEMs using outgassing material to adjust the pressure level in a cavity | Yuan-Chih Hsieh | 2023-04-25 |
| 11371133 | Undercut-free patterned aluminum nitride structure and methods for forming the same | Yuan-Chih Hsieh, Yi-Ren Wang | 2022-06-28 |
| 11292715 | Conductive bond structure to increase membrane sensitivity in MEMS device | Chia-Ming Hung, Xin-Hua Huang, Yuan-Chih Hsieh | 2022-04-05 |
| 11282697 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2022-03-22 |
| 11279615 | Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer | Chang-Ming Wu, Chung-Yi Yu, Ping-Yin Liu, Jung-Huei Peng | 2022-03-22 |
| 11180363 | Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same | Kuei-Sung Chang, Tai-Bang An, Chun-Wen Cheng | 2021-11-23 |
| 11130670 | MEMS devices with an element having varying widths | Shang-Ying Tsai, Hsin-Ting Huang, Lung Yuan Pan, Jung-Huei Peng, Yao-Te Huang | 2021-09-28 |
| 11050012 | Method to protect electrodes from oxidation in a MEMS device | Yi-Ren Wang, Yuan-Chih Hsieh | 2021-06-29 |
| 10981781 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Shao-Chi Yu +1 more | 2021-04-20 |
| 10781098 | Method of manufacturing semiconductor structure | Ping-Yin Liu, Kuan-Liang Liu, Chia-Shiung Tsai, Alexander Kalnitsky | 2020-09-22 |
| 10665449 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2020-05-26 |
| 10464808 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Shao-Chi Yu +1 more | 2019-11-05 |
| 10294098 | Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer | Chang-Ming Wu, Chung-Yi Yu, Ping-Yin Liu, Jung-Huei Peng | 2019-05-21 |
| 10280076 | Semiconductor structure and manufacturing method thereof | Ping-Yin Liu, Kuan-Liang Liu, Chia-Shiung Tsai, Alexander Kalnitsky | 2019-05-07 |
| 10266390 | Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring | Shang-Ying Tsai, Hsin-Ting Huang, Lung Yuan Pan, Jung-Huei Peng, Yao-Te Huang | 2019-04-23 |
| 10119909 | Biological sensing structures | Li-Cheng Chu, Ming-Tung Wu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2018-11-06 |