Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12297103 | Device for protecting FEOL element and BEOL element | Ping-Chun Yeh, Lien-Yao Tsai | 2025-05-13 |
| 11345591 | Device for protecting FEOL element and BEOL element | Ping-Chun Yeh, Lien-Yao Tsai | 2022-05-31 |
| 10981781 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Hung-Hua Lin +1 more | 2021-04-20 |
| 10508028 | Device for protecting FEOL element and BEOL element | Ping-Chun Yeh, Lien-Yao Tsai | 2019-12-17 |
| 10464808 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Hung-Hua Lin +1 more | 2019-11-05 |
| 10392244 | Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity | Chia-Ming Hung, Hsiang-Fu Chen, Wen-Chuan Tai, Hsin-Ting Huang | 2019-08-27 |
| 10155660 | Device and method for protecting FEOL element and BEOL element | Ping-Chun Yeh, Lien-Yao Tsai | 2018-12-18 |
| 10131540 | Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications | Chia-Ming Hung, Hsin-Ting Huang, Hsiang-Fu Chen, Allen Timothy Chang, Wen-Chuan Tai | 2018-11-20 |
| 10049941 | Semiconductor isolation structure with air gaps in deep trenches | Hong-Seng Shue, Tai-I Yang, Wei-Ding Wu, Ming-Tai Chung | 2018-08-14 |
| 9856139 | Microelectromechanical systems (MEMS) devices at different pressures | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Allen Timothy Chang +2 more | 2018-01-02 |
| 9845236 | Monolithic MEMS platform for integrated pressure, temperature, and gas sensor | Chia-Ming Hung, Hsin-Ting Huang, Hsiang-Fu Chen, Allen Timothy Chang, Wen-Chuan Tai | 2017-12-19 |
| 9776858 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Hung-Hua Lin +1 more | 2017-10-03 |
| 9714166 | Thin film structure for hermetic sealing | Hsiang-Fu Chen, Hsin-Ting Huang, Chia-Ming Hung, Wen-Chuan Tai | 2017-07-25 |
| 9656857 | Microelectromechanical systems (MEMS) devices at different pressures | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Allen Timothy Chang +2 more | 2017-05-23 |
| 9614031 | Methods for forming a high-voltage super junction by trench and epitaxial doping | Tai-I Yang, Shou-Wei Lee, Hong-Seng Shue, Kun-Ming Huang, Po-Tao Chu | 2017-04-04 |
| 9567204 | Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device | Chia-Ming Hung, Hsiang-Fu Chen, Wen-Chuan Tai, Hsin-Ting Huang | 2017-02-14 |
| 9269609 | Semiconductor isolation structure with air gaps in deep trenches | Hong-Seng Shue, Tai-I Yang, Wei-Ding Wu, Ming-Tai Chung | 2016-02-23 |
| 9202792 | Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV) | Chia-Ming Hung, Hsiang-Fu Chen, Wen-Chuan Tai, Hsin-Ting Huang | 2015-12-01 |
| 9093520 | High-voltage super junction by trench and epitaxial doping | Tai-I Yang, Shou-Wei Lee, Hong-Seng Shue, Kun-Ming Huang, Po-Tao Chu | 2015-07-28 |
| 8558330 | Deep well process for MEMS pressure sensor | Hong-Seng Shue | 2013-10-15 |