Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10053361 | Method of selectively removing an anti-stiction layer on a eutectic bonding area | Yuan-Chih Hsieh, Wen-Chuan Tai, Hsiang-Fu Chen | 2018-08-21 |
| 9776852 | Method for controlling surface roughness in MEMS structure | Yuan-Chih Hsieh, Lee-Chuan Tseng | 2017-10-03 |
| 9776858 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Shao-Chi Yu +1 more | 2017-10-03 |
| 9741681 | Debonding schemes | Xin-Hua Huang, Ping-Yin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2017-08-22 |
| 9708179 | Method of improving getter efficiency by increasing superficial area | Yuan-Chih Hsieh, Li-Cheng Chu, Chih-Jen Chan, Lan-Lin Chao | 2017-07-18 |
| 9611141 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Li-Cheng Chu, Shang-Ying Tsai, Yuan-Chih Hsieh, Jung-Huei Peng +3 more | 2017-04-04 |
| 9508586 | Debonding schemes | Xin-Hua Huang, Ping-Yin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2016-11-29 |
| 9446467 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Xin-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2016-09-20 |
| 9377401 | Biological sensing structures | Li-Cheng Chu, Ming-Tung Wu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2016-06-28 |
| 9293445 | Wafer level packaging bond | Ping-Yin Liu, Li-Chen CHU, H. T. Huang, Jung-Huei Peng, Yuan-Chih Hsieh +3 more | 2016-03-22 |
| 9242853 | Method of improving getter efficiency by increasing superficial area | Yuan-Chih Hsieh, Li-Cheng Chu, Chih-Jen Chan, Lan-Lin Chao | 2016-01-26 |
| 9181083 | MEMS devices and methods of forming the same | Shang-Ying Tsai, Lung Yuan Pan, Yao-Te Huang, Hsin-Ting Huang, Jung-Huei Peng | 2015-11-10 |
| 8945344 | Systems and methods of separating bonded wafers | Xin-Hua Huang, Ping-Yin Liu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2015-02-03 |
| 8905293 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Li-Cheng Chu, Shang-Ying Tsai, Yuan-Chih Hsieh, Jung-Huei Peng +3 more | 2014-12-09 |
| 8853801 | MEMS devices and methods of forming the same | Shang-Ying Tsai, Jung-Huei Peng, Hsin-Ting Huang, Yao-Te Huang, Lung Yuan Pan | 2014-10-07 |
| 8846129 | Biological sensing structures and methods of forming the same | Li-Cheng Chu, Ming-Tung Wu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai | 2014-09-30 |
| 8802538 | Methods for hybrid wafer bonding | Ping-Yin Liu, Jen-Cheng Liu, Xiaomeng Chen, Xin-Hua Huang, Lan-Lin Chao +1 more | 2014-08-12 |
| 8735260 | Method to prevent metal pad damage in wafer level package | Shang-Ying Tsai, Jung-Huei Peng, Hsin-Ting Huang, Ming-Tung Wu, Ping-Yin Liu +2 more | 2014-05-27 |
| 8647962 | Wafer level packaging bond | Martin Liu, Richard Chu, Hsin-Ting Huang, Jung-Huei Peng, Yuan-Chih Hsieh +3 more | 2014-02-11 |
| 8633086 | Power devices having reduced on-resistance and methods of their manufacture | Alex Kalnitsky, Hsiao-Chin Tuan, Liang Han, Uway Tseng, Yuan-Chih Hsieh | 2014-01-21 |
| 8405169 | Handling layer for transparent substrate | Chun-Ren Cheng, Yi-Hsien Chang, Allen Timothy Chang, Ching-Ray Chen, Li-Cheng Chu +2 more | 2013-03-26 |