Issued Patents All Time
Showing 1–25 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12363998 | Recessed gate for an MV device | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Alexander Kalnitsky, Kong-Beng Thei +2 more | 2025-07-15 |
| 12211926 | Method and related apparatus for reducing gate-induced drain leakage in semiconductor devices | Kong-Beng Thei, Chien-Chih Chou, Yi-Huan Chen, Alexander Kalnitsky | 2025-01-28 |
| 11978810 | Method for forming an IC including a varactor with reduced surface field region | Liang-Yu Su, Chih-Wen Yao, Ming-Ta Lei | 2024-05-07 |
| 11948938 | Recessed gate for an MV device | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Alexander Kalnitsky, Kong-Beng Thei +2 more | 2024-04-02 |
| 11823959 | FUSI gated device formation | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Alexander Kalnitsky, Kong-Beng Thei +1 more | 2023-11-21 |
| 11710712 | Semiconductor device and manufacturing method of the same | Jhu-Min Song, Fu-Jier Fan, Kong-Beng Thei, Alexander Kalnitsky | 2023-07-25 |
| 11705449 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Jen-Cheng Liu +2 more | 2023-07-18 |
| 11646308 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Jen-Cheng Liu +2 more | 2023-05-09 |
| 11527531 | Recessed gate for an MV device | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Alexander Kalnitsky, Kong-Beng Thei +2 more | 2022-12-13 |
| 11302691 | High voltage integration for HKMG technology | Kong-Beng Thei, Chien-Chih Chou, Fu-Jier Fan, Yi-Huan Chen, Alexander Kalnitsky +1 more | 2022-04-12 |
| 11251286 | Method and related apparatus for reducing gate-induced drain leakage in semiconductor devices | Kong-Beng Thei, Chien-Chih Chou, Yi-Huan Chen, Alexander Kalnitsky | 2022-02-15 |
| 11251314 | Memory devices and methods of manufacture thereof | Alexander Kalnitsky, Felix Ying-Kit Tsui, Hau-Yan Lu | 2022-02-15 |
| 11133226 | FUSI gated device formation | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Alexander Kalnitsky, Kong-Beng Thei +1 more | 2021-09-28 |
| 11063038 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Jen-Cheng Liu +2 more | 2021-07-13 |
| 11018266 | Reduced surface field layer in varactor | Liang-Yu Su, Chih-Wen Yao, Ming-Ta Lei | 2021-05-25 |
| 11011619 | Method and related apparatus for reducing gate-induced drain leakage in semiconductor devices | Kong-Beng Thei, Chien-Chih Chou, Yi-Huan Chen, Alexander Kalnitsky | 2021-05-18 |
| 10964692 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Jen-Cheng Liu +2 more | 2021-03-30 |
| 10790279 | High voltage integration for HKMG technology | Kong-Beng Thei, Chien-Chih Chou, Fu-Jier Fan, Yi-Huan Chen, Alexander Kalnitsky +1 more | 2020-09-29 |
| 10770598 | Memory devices and methods of manufacture thereof | Alexander Kalnitsky, Felix Ying-Kit Tsui, Hau-Yan Lu | 2020-09-08 |
| 10629592 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Jen-Cheng Liu +2 more | 2020-04-21 |
| 10535752 | Method and related apparatus for reducing gate-induced drain leakage in semiconductor devices | Kong-Beng Thei, Chien-Chih Chou, Yi-Huan Chen, Alexander Kalnitsky | 2020-01-14 |
| 10510750 | High voltage integration for HKMG technology | Kong-Beng Thei, Chien-Chih Chou, Fu-Jier Fan, Yi-Huan Chen, Alexander Kalnitsky +1 more | 2019-12-17 |
| 10510902 | Memory devices and methods of manufacture thereof | Alexander Kalnitsky, Felix Ying-Kit Tsui, Hau-Yan Lu | 2019-12-17 |
| 10381259 | Semiconductor device with localized carrier lifetime reduction and fabrication method thereof | Alex Kalnitsky, Chih-Wen Yao, Jun Cai, Ruey-Hsin Liu | 2019-08-13 |
| 10050033 | High voltage integration for HKMG technology | Kong-Beng Thei, Chien-Chih Chou, Fu-Jier Fan, Yi-Huan Chen, Alexander Kalnitsky +1 more | 2018-08-14 |