Issued Patents All Time
Showing 1–25 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12342538 | Non-volatile memory (NVM) cell structure to increase reliability | Shih-Hsien Chen, Chun-Yao Ko | 2025-06-24 |
| 12328959 | Image sensor with improved timing resolution and photon detection probability | Wen-Shun Lo | 2025-06-10 |
| 12272725 | Low warpage high density trench capacitor | Jyun-Ying Lin, Hsin-Li Cheng, Jing-Hwang Yang, Chien-Li Kuo | 2025-04-08 |
| 12176387 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su +4 more | 2024-12-24 |
| 12085761 | Two-dimensional grating coupler and methods of making same | Chih-Tsung Shih, Chewn-Pu Jou, Stefan Rusu, Lan-Chou Cho | 2024-09-10 |
| 11980864 | Bio-sensing and temperature-sensing integrated circuit | Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Yung-Chow Peng | 2024-05-14 |
| 11960116 | Optical waveguide coupler | Chih-Tsung Shih, Chewn-Pu Jou, Stefan Rusu | 2024-04-16 |
| 11844213 | Non-volatile memory (NVM) cell structure to increase reliability | Shih-Hsien Chen, Chun-Yao Ko | 2023-12-12 |
| 11830888 | Image sensor with improved timing resolution and photon detection probability | Wen-Shun Lo | 2023-11-28 |
| 11828722 | Biological device and biosensing method thereof | Ta-Chuan Liao, Chien-Kuo Yang, Yi-Shao Liu, Tung-Tsun Chen, Chan-Ching Lin +2 more | 2023-11-28 |
| 11769792 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su +4 more | 2023-09-26 |
| 11693186 | Two-dimensional grating coupler and methods of making same | Chih-Tsung Shih, Chewn-Pu Jou, Stefan Rusu, Lan-Chou Cho | 2023-07-04 |
| 11688762 | Low warpage high density trench capacitor | Jyun-Ying Lin, Hsin-Li Cheng, Jing-Hwang Yang, Chien-Li Kuo | 2023-06-27 |
| 11504690 | Bio-sensing and temperature-sensing integrated circuit | Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Yung-Chow Peng | 2022-11-22 |
| 11508658 | Semiconductor device package and method of manufacturing the same | Hau-Yan Lu, Jing-Hwang Yang, Feng Yuan | 2022-11-22 |
| 11498044 | Bio-sensing and temperature-sensing integrated circuit | Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Yung-Chow Peng | 2022-11-15 |
| 11491455 | Bio-sensing and temperature-sensing integrated circuit | Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Yung-Chow Peng | 2022-11-08 |
| 11446630 | Bio-sensing and temperature-sensing integrated circuit | Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Yung-Chow Peng | 2022-09-20 |
| 11417670 | Structure and method for single gate non-volatile memory device | Huang-Wen Tseng | 2022-08-16 |
| 11387242 | Non-volatile memory (NVM) cell structure to increase reliability | Shih-Hsien Chen, Chun-Yao Ko | 2022-07-12 |
| 11367731 | Memory device and method of manufacturing the same | Hau-Yan Lu, Chun-Yao Ko | 2022-06-21 |
| 11251314 | Memory devices and methods of manufacture thereof | Alexander Kalnitsky, Hsiao-Chin Tuan, Hau-Yan Lu | 2022-02-15 |
| 11152383 | Non-volatile memory (NVM) cell structure to increase reliability | Shih-Hsien Chen, Chun-Yao Ko | 2021-10-19 |
| 11063157 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su +4 more | 2021-07-13 |
| 11018168 | Image sensor with improved timing resolution and photon detection probability | Wen-Shun Lo | 2021-05-25 |