ML

Martin Liu

TSMC: 13 patents #2,298 of 12,232Top 20%
GH Guangzhou Homfel: 2 patents #3 of 6Top 50%
FA Flextronics Ap: 1 patents #179 of 385Top 50%
Overall (All Time): #286,023 of 4,157,543Top 7%
16
Patents All Time

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
12355026 Method of writing to or erasing multi-bit memory storage device Meng-Han Lin, Chia-En Huang, Han-Jong Chia, Sai-Hooi Yeong, Yih Wang 2025-07-08
11869971 Multi-bit memory storage device Meng-Han Lin, Chia-En Huang, Han-Jong Chia, Sai-Hooi Yeong, Yih Wang 2024-01-09
11848381 Methods of operating multi-bit memory storage device Meng-Han Lin, Chia-En Huang, Han-Jong Chia, Sai-Hooi Yeong, Yih Wang 2023-12-19
11532746 Multi-bit memory storage device and method of operating same Meng-Han Lin, Chia-En Huang, Han-Jong Chia, Sai-Hooi Yeong, Yih Wang 2022-12-20
D915712 Dustbin 2021-04-06
10323790 Rotary suction cup 2019-06-18
9337168 Hermetic wafer level packaging Richard Chu, Chia-Hua Chu, Yuan-Chih Hsieh, Chung-Hsien Lin, Lan-Lin Chao +2 more 2016-05-10
8964413 Two stage resonant converter enabling soft-switching in an isolated stage 2015-02-24
8851133 Method and apparatus of holding a device Chung-Yi Yu, Che Ying Hsu, Yeur-Luen Tu, Da-Hsiang Chou, Chia-Shiung Tsai 2014-10-07
8647962 Wafer level packaging bond Richard Chu, Hung-Hua Lin, Hsin-Ting Huang, Jung-Huei Peng, Yuan-Chih Hsieh +3 more 2014-02-11
8648468 Hermetic wafer level packaging Richard Chu, Chia-Hua Chu, Yuan-Chih Hsieh, Chung-Hsien Lin, Lan-Lin Chao +2 more 2014-02-11
8598687 Semiconductor having a high aspect ratio via Yuan-Chih Hsieh, Richard Chu, Ming-Tung Wu, Lan-Lin Chao, Chia-Shiung Tsai 2013-12-03
8445380 Semiconductor having a high aspect ratio via Yuan-Chih Hsieh, Richard Chu, Ming-Tung Wu, Lan-Lin Chao, Chia-Shiung Tsai 2013-05-21
8207595 Semiconductor having a high aspect ratio via Yuan-Chih Hsieh, Richard Chu, Ming-Tung Wu, Lan-Lin Chao, Chia-Shiung Tsai 2012-06-26
8173518 Method of wafer bonding Alex Hsu, Chung-Yi Yu, Chia-Shiung Tsai 2012-05-08
8048807 Method and apparatus for thinning a substrate Ming Chyi Liu, Yao Fei Chuang, Gwo-Yuh Shiau, Chia-Shiung Tsai 2011-11-01