Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11575318 | Voltage converters with hysteretic control | Paolo Nora | 2023-02-07 |
| 10871427 | Biological liquid collection vessels, systems, and methods | Scott Salmon, Radu Saftoiu | 2020-12-22 |
| 10756627 | Enhanced switching regulator topology with adaptive duty control and seamless transition of operating modes | Sam Tung Tsui, Paolo Nora, Tsz Yin Man | 2020-08-25 |
| 10110610 | Dynamic permission assessment and reporting engines | Viktor Povalyayev, Senthil Chinnathambi, Lata Krishnamohan | 2018-10-23 |
| D789292 | Li-Ion jump starter | Lance Kotsubo | 2017-06-13 |
| 9674993 | Flame retardant, electrically conductive adhesive materials and related methods | Larry Creasy, Yishen Lin | 2017-06-06 |
| 8440495 | Method for reducing crosstalk in image sensors using implant technology | Jen-Cheng Liu, Chin-Hong Cheng, Chien-Hsien Tseng, Feng-Jia Shiu, Shou-Gwo Wuu | 2013-05-14 |
| 8405177 | Method to optimize substrate thickness for image sensor device | Tzu-Hsuan Hsu, Ching-Chun Wang | 2013-03-26 |
| 8178422 | Method of measurement in semiconductor fabrication | Shih-Chi Fu, Feng-Jia Shiu, Chia-Shiung Tsai | 2012-05-15 |
| 8173518 | Method of wafer bonding | Martin Liu, Chung-Yi Yu, Chia-Shiung Tsai | 2012-05-08 |
| 8030721 | Method to optimize substrate thickness for image sensor device | Tzu-Hsuan Hsu, Ching-Chun Wang | 2011-10-04 |
| 7838325 | Method to optimize substrate thickness for image sensor device | Tzu-Hsuan Hsu, Ching-Chun Wang | 2010-11-23 |
| 7018113 | Optical module package | Jianhua Wang, Qinglin Wang, Yanyan Ma, Hongtao Hou | 2006-03-28 |