Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337168 | Hermetic wafer level packaging | Martin Liu, Chia-Hua Chu, Yuan-Chih Hsieh, Chung-Hsien Lin, Lan-Lin Chao +2 more | 2016-05-10 |
| 8647962 | Wafer level packaging bond | Martin Liu, Hung-Hua Lin, Hsin-Ting Huang, Jung-Huei Peng, Yuan-Chih Hsieh +3 more | 2014-02-11 |
| 8648468 | Hermetic wafer level packaging | Martin Liu, Chia-Hua Chu, Yuan-Chih Hsieh, Chung-Hsien Lin, Lan-Lin Chao +2 more | 2014-02-11 |
| 8598687 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Ming-Tung Wu, Martin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2013-12-03 |
| 8445380 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Ming-Tung Wu, Martin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2013-05-21 |
| 8207595 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Ming-Tung Wu, Martin Liu, Lan-Lin Chao, Chia-Shiung Tsai | 2012-06-26 |
| 5353619 | Apparatus and method for necking tubular members such as containers | Roger A. Hahn | 1994-10-11 |
| 4389357 | Method for preparing thermosetting resins | Maher L. Mansour | 1983-06-21 |